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PCF8574ARGYRG4

Texas Instruments

PCF8574ARGYRG4 by Texas Instruments

PCF8574ARGYRG4 by Texas Instruments is a parallel I/O port with 8 address bus width and 8 bits. It operates at a max supply voltage of 6V and is commonly used in industrial applications for general-purpose parallel IO port functionality.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Euro-Tech

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Vyrian

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Bristol Electronics

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Digiode

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Nova Conductors

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One Stop Electronics

USA . 1,418 parts In-Stock

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Ampacity Inc.

Singapore . 867 parts In-Stock

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AZTECH Wire

Italy . 677 parts In-Stock

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Corohmni

South Africa . 78 parts In-Stock

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Parana Technologies

USA . 479 parts In-Stock

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IDEA Electronic Components Group

UK . 2,353 parts In-Stock

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$79.508

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$75.324

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ChromeModa Solutions

Germany . 478 parts In-Stock

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Continental Prestige Electronics

USA . 4,248 parts In-Stock

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Argo Parts USA

USA . 4,052 parts In-Stock

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Microchip USA

USA . 2,463 parts In-Stock

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DigiPath Technology Company

USA . 1,575 parts In-Stock

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Corphita

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Aranea Global

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Overview

Enhance your electronic projects with the high-quality PCF8574ARGYRG4 by Texas Instruments. As a leading manufacturer, Texas Instruments offers top-notch products that meet industry standards and surpass customer expectations. The PCF8574ARGYRG4 falls under the category of Parallel I/O Ports, making it versatile for various applications. With its compact size and efficient design, this product provides excellent value and benefits to customers. Unlock endless possibilities with the PCF8574ARGYRG4 and experience seamless performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and light weight, making it an excellent choice for portable or rugged applications.

Surface Mount: YES

The surface mount capability of this product allows for easy integration into circuit boards, simplifying the manufacturing process and reducing overall assembly time.

Maximum Supply Voltage: 6 V

With a maximum supply voltage of 6 V, this product can handle a wide range of power inputs, providing flexibility for various system requirements.

Address Bus Width: 8

The 8-bit address bus width of this product allows for efficient data transmission and management, making it ideal for applications that require ample address space.

Package Shape: RECTANGULAR

The rectangular package shape not only provides a standardized form factor for compatibility with other components, but also facilitates efficient PCB layout, optimizing space utilization.

No. of Bits: 8

With 8 bits, this product is capable of processing and transmitting data in parallel, enabling faster data transfer and enhanced overall performance.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this product offers versatility in system design and compatibility with various power sources.

No. of Terminals: 20

The presence of 20 terminals in this product ensures connectivity options for various peripherals and other devices, expanding the range of possible applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, combined with a heat sink/slug and a very thin profile, allows for efficient heat dissipation, contributing to improved reliability and longevity.

Minimum Supply Voltage: 2.5 V

With a minimum supply voltage of 2.5 V, this product can be operated using lower power sources, reducing energy consumption and enabling use in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation in demanding environments, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions without sacrificing performance, extending its usability in diverse environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent corrosion resistance and reliable electrical connections, enhancing the overall durability and lifespan of the product.

Terminal Position: QUAD

The quad terminal position offers flexible options for connecting peripheral devices, accommodating multiple setups and configurations to meet specific application requirements.

No. of Ports: 1

Featuring a single port, this product simplifies system design by eliminating the need for additional ports, streamlining integration and reducing costs.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1 mm, this product offers a compact form factor, allowing for easier integration into space-limited designs or applications.

Width: 3.5 mm

The narrow width of 3.5 mm makes this product suitable for compact electronic layouts, optimizing space utilization and enabling use in smaller devices.

Maximum Clock Frequency: 0.1 MHz

Operating at a maximum clock frequency of 0.1 MHz, this product delivers reliable and precise timing signals, ensuring accurate data synchronization and integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C facilitates efficient and reliable soldering during the manufacturing process, ensuring robust connections and preventing solder defects.

Length: 4.5 mm

With a length of 4.5 mm, this product offers a compact and space-saving solution, enabling its use in small form-factor devices or applications with limited available space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that this product is capable of withstanding harsh environmental conditions, making it suitable for industrial or outdoor applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This product is a general-purpose parallel I/O port peripheral IC, providing versatile functionality to interface with various external devices and systems.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, fast switching times, and high noise immunity, making it a reliable and energy-efficient choice for diverse applications.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's resistance to mechanical stress and strain, ensuring reliable connections and minimizing the risk of solder joint failure.

Maximum Supply Current: 0.1 mA

With a maximum supply current of 0.1 mA, this product operates at low power consumption levels, contributing to energy efficiency and longer battery life in portable applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying system integration and reducing the need for additional voltage regulation.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm facilitates higher-density board layouts, allowing for more compact designs and enabling use in applications requiring miniaturization.

Moisture Sensitivity Level (MSL): 2

With an MSL level of 2, this product has an extended floor life and can tolerate moderate exposure to moisture, ensuring consistent performance and reliability throughout its lifespan.

No. of I/O Lines: 8

Equipped with 8 I/O lines, this product offers ample input/output options for connecting peripheral devices or interfacing with external systems, providing flexibility for versatile applications.

Technical Specifications

Parallel I/O Ports PCF8574ARGYRG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

.1 MHz

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Current:

.1 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

PCF8574ARGYRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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