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PCA9555DB/G,118

NXP Semiconductors

PCA9555DB/G,118 by NXP Semiconductors

PCA9555DB/G,118 by NXP Semiconductors is a Parallel I/O Port with 16 bits, operating at 2.3-5.5V. It comes in a small outline package and is ideal for industrial applications requiring general-purpose parallel I/O functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,526 parts In-Stock

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Anansix

USA . 1,285 parts In-Stock

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Vyrian

USA . 419 parts In-Stock

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419

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Nova Conductors

Japan . 24 parts In-Stock

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24

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AZTECH Wire

Italy . 419 parts In-Stock

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$8.067

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419

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Ampacity Inc.

Singapore . 1,439 parts In-Stock

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$10.000

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One Stop Electronics

USA . 372 parts In-Stock

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Corohmni

South Africa . 549 parts In-Stock

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$24.598

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Semicontronic

India . 922 parts In-Stock

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$31.000

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$30.225

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$30.070

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922

$31.000

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Aztec Data Supply Inc.

USA . 2,727 parts In-Stock

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$34.720

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Argo Parts USA

USA . 4,371 parts In-Stock

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Corphita

USA . 3,971 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 870 parts In-Stock

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UNI Independent Distributors

Spain . 329 parts In-Stock

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Continental Prestige Electronics

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Overview

Unlock endless possibilities with the PCA9555DB/G,118 by NXP Semiconductors. Crafted with precision and expertise, this Parallel I/O Ports device offers unparalleled quality and reliability. Perfect for various applications, this versatile product provides seamless integration and superior performance. Experience convenience and efficiency like never before with the PCA9555DB/G,118. Elevate your projects to new heights with NXP Semiconductors' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Can be easily mounted on a circuit board, making installation straightforward.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Compact shape that allows for efficient use of space on the PCB.

No. of Bits: 16

Offers a good balance between resolution and complexity for parallel I/O operations.

Minimum Supply Voltage: 2.3 V

Supports low supply voltages, which can be beneficial for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding the range of possible applications.

No. of Ports: 2

Provides multiple ports for connecting to different devices or systems simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall efficiency.

No. of I/O Lines: 16

Sufficient number of I/O lines for versatile input and output operations.

Technical Specifications

Parallel I/O Ports PCA9555DB/G,118 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

Length:

8.2 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCA9555DB/G,118 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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