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PCA9555RGERG4

Texas Instruments

PCA9555RGERG4 by Texas Instruments

PCA9555RGERG4 by Texas Instruments is a Parallel I/O Port with 16 bits, 2.3-5.5V supply voltage range, and 0.4 MHz clock frequency. Ideal for industrial applications requiring general-purpose parallel I/O interfacing in compact spaces due to its small form factor and low power consumption of 0.2 mA at 3V nominal voltage.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 104,052 parts In-Stock

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Vyrian

USA . 6,400 parts In-Stock

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Digiode

USA . 2,963 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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One Stop Electronics

USA . 805 parts In-Stock

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$15.000

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805

$15.000

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AZTECH Wire

Italy . 783 parts In-Stock

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$18.594

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Semicontronic

India . 910 parts In-Stock

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$24.000

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$23.400

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$23.280

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910

$24.000

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Parana Technologies

USA . 782 parts In-Stock

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$31.234

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$2,900.519

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$28.110

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Ampacity Inc.

Singapore . 1,345 parts In-Stock

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$34.000

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DigiPath Technology Company

USA . 1,944 parts In-Stock

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$34.392

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$31.641

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ChromeModa Solutions

Germany . 3,350 parts In-Stock

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$35.094

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$28.777

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$35.094

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

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$35.094

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$33.339

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$31.585

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$40.116

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$38.111

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$38.111

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Corohmni

South Africa . 5,094 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,587 parts In-Stock

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GreenTree Electronics

Israel . 7,116 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,002 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Microchip USA

USA . 1,013 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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$13.220

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9555RGERG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This Parallel I/O Ports device offers unparalleled quality and reliability, making it ideal for various applications in industrial settings. With its advanced features and efficient design, this product provides exceptional value and benefits to customers, allowing for seamless integration and enhanced performance. Experience innovation like never before with the PCA9555RGERG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and resistance to environmental factors, making the product reliable in various conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance allows for flexibility in power supply options, ensuring compatibility with a wide range of systems.

Address Bus Width: 8

An 8-bit address bus width provides sufficient addressability for connecting to multiple devices and peripherals, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape is compact and space-efficient, ideal for applications where board space is limited.

No. of Bits: 16

A 16-bit design offers ample data processing capabilities, enabling the product to handle larger datasets and complex tasks with ease.

Power Supplies (V): 2.5/5

Support for dual power supply voltages (2.5V and 5V) allows for compatibility with a wider range of systems and devices.

No. of Terminals: 24

With 24 terminals, the product offers plenty of connectivity options for interfacing with external devices and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and thin profile package styles provides efficient heat dissipation and space-saving benefits, improving overall product performance and reliability.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating allows for reliable operation in hot environments, making the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures the product can function in cold conditions without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal position offers secure and stable connections, reducing the risk of signal interference or disconnections.

No. of Ports: 2

Two ports provide flexibility for connecting to multiple devices or peripherals simultaneously, enhancing the product's multitasking capabilities.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact design, suitable for space-constrained applications.

Width: 4 mm

The narrow width dimension saves space on the PCB, enabling more compact and efficient system designs.

Maximum Clock Frequency: 0.4 MHz

The moderate maximum clock frequency supports efficient data transfer and processing, suitable for a wide range of applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the rigors of the soldering process, improving manufacturing efficiency.

Length: 4 mm

The compact length dimension contributes to a space-saving design, ideal for applications with limited board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates the product's reliability and performance in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

The peripheral IC type of parallel I/O port with general-purpose functionality ensures compatibility with a wide range of devices and peripherals, enhancing the product's versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: NO LEAD

No-lead terminal form enhances solder joint reliability and eliminates the risk of lead contamination, ensuring compliance with environmental regulations.

Maximum Supply Current: 0.2 mA

The low maximum supply current requirement signifies energy efficiency and compatibility with low-power systems, extending battery life and reducing operational costs.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems seamless.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on PCBs, increasing connectivity options and enabling compact system designs.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates the product's tolerance to moisture exposure during handling and storage, ensuring long-term reliability and performance.

No. of I/O Lines: 16

Sixteen I/O lines provide ample connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility and functionality.

Technical Specifications

Parallel I/O Ports PCA9555RGERG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

.4 MHz

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Current:

.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9555RGERG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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