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PCF8574TS/F3,118

NXP Semiconductors

PCF8574TS/F3,118 by NXP Semiconductors

PCF8574TS/F3,118 by NXP Semiconductors is a CMOS technology-based Parallel I/O Port with 8 I/O lines. It operates b/w -40 to 85 °C and supports supply voltage range of 2.5V to 6V. Widely used in industrial applications for general purpose parallel input/output operations due to its small form factor and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,680 parts In-Stock

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1,680

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Digiode

USA . 1,096 parts In-Stock

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1,096

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Vyrian

USA . 531 parts In-Stock

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531

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Nova Conductors

Japan . 45 parts In-Stock

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45

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Ampacity Inc.

Singapore . 897 parts In-Stock

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$5.000

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897

$5.000

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AZTECH Wire

Italy . 304 parts In-Stock

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$12.262

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One Stop Electronics

USA . 865 parts In-Stock

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$14.000

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865

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Semicontronic

India . 1,366 parts In-Stock

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$34.000

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$33.150

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$32.980

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$34.000

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$32.980

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$34.653

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$32.921

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$32.921

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$32.921

$32.921

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Aztec Data Supply Inc.

USA . 1,068 parts In-Stock

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$45.940

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1,068

$45.940

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Corohmni

South Africa . 988 parts In-Stock

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$84.118

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988

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UNI Independent Distributors

Spain . 8,248 parts In-Stock

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Continental Prestige Electronics

USA . 5,644 parts In-Stock

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Argo Parts USA

USA . 4,831 parts In-Stock

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Corphita

USA . 3,999 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Enhance your electronic designs with the cutting-edge PCF8574TS/F3,118 by NXP Semiconductors. This high-quality Parallel I/O Port offers unparalleled versatility and reliability, making it a must-have component for a wide range of applications. From industrial automation to consumer electronics, this product provides seamless integration and precise control. Experience the value and benefits of NXP Semiconductors' innovative technology with the PCF8574TS/F3,118. Elevate your projects to new heights with this top-of-the-line solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 6 V

Allows for versatile compatibility with a wide range of devices and systems.

Minimum Operating Temperature: -40 °C

Ensures reliability even in extreme cold environments.

Technology: CMOS

Offers low power consumption and high noise immunity, making it suitable for various applications.

No. of I/O Lines: 8

Provides flexibility for connecting multiple input and output devices simultaneously.

Technical Specifications

Parallel I/O Ports PCF8574TS/F3,118 attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCF8574TS/F3,118 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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