Loading...

PSD813F1A-15JT

STMicroelectronics

PSD813F1A-15JT by STMicroelectronics

PSD813F1A-15JT by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports max access time of 150 ns, ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,691 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,691

-

-

-

-

Vyrian

USA . 1,873 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,873

-

-

-

-

Anansix

USA . 770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

770

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 507 parts In-Stock

1+ parts

$26.569

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$26.569

-

-

-

IDEA Electronic Components Group

UK . 9 parts In-Stock

1+ parts

$27.420

100+ parts

-

1k+ parts

$24.678

10k+ parts

-

9

$27.420

-

$24.678

-

MKK Technologies

India . 99 parts In-Stock

1+ parts

$51.561

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$51.561

-

-

-

DigiPath Technology Company

USA . 99 parts In-Stock

1+ parts

$51.561

100+ parts

-

1k+ parts

-

10k+ parts

-

99

$51.561

-

-

-

Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

-

100+ parts

$32.784

1k+ parts

-

10k+ parts

-

2,188

-

$32.784

-

-

Corphita

USA . 1,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,382

-

-

-

-

Overview

Unlock limitless possibilities with the PSD813F1A-15JT from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality Parallel I/O Port offers unparalleled performance and reliability, perfect for a wide range of applications—from consumer electronics to industrial automation. Its compact design ensures easy integration, while its low power consumption translates into cost-effective operations. Elevate your projects with this robust solution that embodies ST's commitment to excellence and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and resistance to environmental factors.

Surface Mount: YES

Facilitates compact design and easy integration on PCBs, ideal for modern applications.

Maximum Supply Voltage: 5.5 V

Allows compatibility with a variety of power systems while ensuring safety margins.

Package Shape: SQUARE

Optimized shape for efficient space utilization on circuit boards.

Power Supplies (V): 5

Standard voltage supports a wide range of devices and systems.

No. of Terminals: 52

Provides ample connections for various devices, enhancing versatility.

Package Style (Meter): CHIP CARRIER

Robust design suitable for reliable surface mounting in commercial applications.

Minimum Supply Voltage: 4.5 V

Ensures functionality across a range of power supplies, enhancing usability.

Maximum Operating Temperature: 70 °C

High operational temperature limits enable use in demanding environments.

Minimum Operating Temperature: 0 °C

Ensures reliable performance in various climate conditions.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance, ensuring strong connections.

Ultraviolet Erasable: N

Standard IC without UV erase simplifies design and usage, reducing complexity.

Terminal Position: QUAD

Optimized for layout flexibility, aiding in circuit design efficiencies.

No. of Ports: 4

Multiple ports allow simultaneous connections to different devices, enhancing functionality.

Maximum Seated Height: 4.57 mm

Compact height simplifies integration into space-constrained designs.

Width: 19.1 mm

Standard width ensures compatibility with a wide range of PCB layouts.

Length: 19.1 mm

Balanced dimensions allow for efficient use of space on PCBs.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring reliable performance in everyday use.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile IC suitable for various general-purpose applications, enhancing usability.

ROM Bits Size: 1310720 Bits

Large memory capacity supports complex applications and efficient data handling.

Technology: CMOS

Low power consumption and high-speed operation make it suitable for modern electronics.

Terminal Form: J BEND

Facilitates better soldering and connection quality on PCBs.

Nominal Supply Voltage: 5 V

Common voltage standard simplifies design and integration into existing systems.

Terminal Pitch: 1.27 mm

Standard pitch enhances compatibility with various mounting and layout options.

Maximum Standby Current: 0.0002 Amp

Extremely low standby current improves overall energy efficiency of the circuit.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time ensures high-speed data processing and communication.

No. of I/O Lines: 27

Sufficient number of I/O lines increases flexibility for connections and data handling.

Technical Specifications

Parallel I/O Ports PSD813F1A-15JT attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-15JT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19