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PSD813F1A-12U

STMicroelectronics

PSD813F1A-12U by STMicroelectronics

PSD813F1A-12U by STMicroelectronics is a low-profile, 64-terminal parallel I/O port with a max supply voltage of 5.5V and operates b/w 0 °C to 70 °C. It features a ROM size of 1310720 bits and supports up to 27 I/O lines for versatile applications in embedded systems. Ideal for general-purpose interfacing, it ensures efficient data handling in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,279 parts In-Stock

1+ parts

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3,279

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Anansix

USA . 2,478 parts In-Stock

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2,478

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Vyrian

USA . 179 parts In-Stock

1+ parts

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179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,091 parts In-Stock

1+ parts

$72.088

100+ parts

-

1k+ parts

$64.880

10k+ parts

-

2,091

$72.088

-

$64.880

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Corohmni

South Africa . 295 parts In-Stock

1+ parts

$73.690

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295

$73.690

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MKK Technologies

India . 2,309 parts In-Stock

1+ parts

$135.558

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2,309

$135.558

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DigiPath Technology Company

USA . 2,309 parts In-Stock

1+ parts

$135.558

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2,309

$135.558

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Corphita

USA . 4,418 parts In-Stock

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4,418

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Parana Technologies

USA . 850 parts In-Stock

1+ parts

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100+ parts

$86.193

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850

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$86.193

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Perfect Parts

USA . 1 parts In-Stock

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1

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Overview

Unlock the potential of your designs with the PSD813F1A-12U from STMicroelectronics, a leader in innovative semiconductor solutions. This compact yet powerful parallel I/O port enhances connectivity and performance in your applications, thanks to its robust build and reliable operation under varying conditions. Ideal for consumer electronics, industrial automation, and more, it delivers exceptional value, ensuring your projects achieve efficiency and longevity without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers durability and protection from environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for compact designs, saving board space and enabling easier integration into modern electronic systems.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility in design, accommodating a range of power supply levels.

Package Shape: SQUARE

The square package shape facilitates uniformity in layout and simplifies PCB design.

Power Supplies (V): 5

Operating at a standard supply voltage of 5 V is convenient, as it matches typical digital logic levels.

No. of Terminals: 64

With 64 terminals, this product allows for extensive connectivity options, supporting complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design minimizes space requirements, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V enables reliable operation with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for commercial applications that may experience moderate heat.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C ensures consistent performance in cooler environments.

Ultraviolet Erasable: N

Not being UV erasable suggests simplicity in design, focusing on stability and reliability for typical applications.

Terminal Position: QUAD

The quad terminal position enhances connection density, allowing for a compact footprint.

No. of Ports: 4

Having four ports allows for simultaneous data transfer, increasing efficiency in communication tasks.

Maximum Seated Height: 1.54 mm

A maximum seated height of 1.54 mm keeps the component low-profile, reducing the overall height of the assembly.

Width: 14 mm

A width of 14 mm provides a balance between ease of handling and compact design.

Length: 14 mm

The 14 mm length is conducive to a uniform and organized layout on PCB boards.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring reliability and performance in typical consumer electronics.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being versatile makes this component useful in a wide array of applications, from simple to complex systems.

ROM Bits Size: 1310720 Bits

The sizable ROM bit capacity allows for substantial data storage, enabling the execution of complex functions.

Technology: CMOS

CMOS technology delivers low power consumption and high noise immunity, making it an efficient choice.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and are ideal for automated assembly processes.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V supports compatibility with standard logic circuits, enhancing integration in various designs.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for denser packing of components on PCBs, maximizing component layout efficiency.

Maximum Standby Current: 0.0002 Amp

A minimal maximum standby current promotes energy efficiency, making it suitable for battery-powered applications.

Maximum Access Time: 0.00000012 ns

The ultra-fast access time enhances data transfer speeds, improving the overall performance of the system.

No. of I/O Lines: 27

Having 27 I/O lines provides significant connectivity options for interfacing with other components in the system.

Technical Specifications

Parallel I/O Ports PSD813F1A-12U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

1.54 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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