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PSD813F1A-15JI

STMicroelectronics

PSD813F1A-15JI by STMicroelectronics

PSD813F1A-15JI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square package (19.1mm) and supports industrial temp ranges (-40 °C to 85 °C). Ideal for general-purpose applications requiring reliable data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,886 parts In-Stock

1+ parts

-

100+ parts

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1,886

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Digiode

USA . 778 parts In-Stock

1+ parts

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1k+ parts

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778

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Vyrian

USA . 98 parts In-Stock

1+ parts

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100+ parts

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98

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,805 parts In-Stock

1+ parts

$47.648

100+ parts

-

1k+ parts

$42.883

10k+ parts

-

1,805

$47.648

-

$42.883

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Corohmni

South Africa . 2,374 parts In-Stock

1+ parts

$52.711

100+ parts

-

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10k+ parts

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2,374

$52.711

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MKK Technologies

India . 1,109 parts In-Stock

1+ parts

$89.598

100+ parts

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1,109

$89.598

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DigiPath Technology Company

USA . 1,109 parts In-Stock

1+ parts

$89.598

100+ parts

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1,109

$89.598

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Corphita

USA . 4,705 parts In-Stock

1+ parts

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4,705

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Parana Technologies

USA . 717 parts In-Stock

1+ parts

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100+ parts

$56.970

1k+ parts

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717

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$56.970

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Overview

Unlock the potential of your projects with the PSD813F1A-15JI from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust parallel I/O port is designed for exceptional reliability and performance across diverse applications, from industrial automation to consumer electronics. Enjoy seamless integration with its compact design, ensuring efficient use of space while delivering outstanding functionality. Elevate your designs and experience unparalleled support from a trusted manufacturer committed to innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, enhancing the reliability of the device.

Surface Mount: YES

Surface mount technology allows for compact designs and better performance in high-density applications.

Maximum Supply Voltage: 5.5 V

A higher supply voltage tolerance provides flexibility for a variety of applications without risking damage.

Package Shape: SQUARE

The square shape aids in easier integration into circuit designs, saving space on PCBs.

Power Supplies (V): 5

Designed for standard 5V applications, making it compatible with most systems.

No. of Terminals: 52

A higher number of terminals enables greater connection capabilities for complex functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging supports better thermal management and is advantageous for densely packed circuits.

Minimum Supply Voltage: 4.5 V

This wide voltage range allows for stable operation in various environments and power conditions.

Maximum Operating Temperature: 85 °C

The high operating temperature rating ensures reliability in demanding industrial applications.

Minimum Operating Temperature: -40 °C

Operational capability at low temperatures contributes to performance in harsh environments.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and mechanical reliability in connections.

Ultraviolet Erasable: N

Not UV erasable, simplifying usage in applications where reprogramming is not required.

Terminal Position: QUAD

The quad terminal position provides symmetrical layout options, simplifying design considerations.

No. of Ports: 4

Multiple ports facilitate concurrent data handling, which is essential for efficient system performance.

Maximum Seated Height: 4.57 mm

Low profile aids in compact circuit designs and multi-layer PCB usage.

Width: 19.1 mm

Compact width makes it suitable for space-constrained applications.

Length: 19.1 mm

Standard dimensions allow for ease of integration into existing designs.

Temperature Grade: INDUSTRIAL

Rated for industrial-grade applications, ensuring durability and performance in challenging conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile I/O capabilities make it suitable for a variety of applications.

ROM Bits Size: 1310720 Bits

Large ROM size provides adequate storage for program data and operational instructions.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: J BEND

J bend terminals are easier to handle during assembly and facilitate reliable connections.

Nominal Supply Voltage: 5 V

Standard voltage rating ensures compatibility across various electronic systems.

Terminal Pitch: 1.27 mm

Pitched terminals allow for dense packing and ease of routing on PCBs.

Maximum Standby Current: 0.0002 Amp

Low standby current enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time maximizes performance for high-speed data applications.

No. of I/O Lines: 27

A large number of I/O lines ensures versatile interfacing options for various devices.

Technical Specifications

Parallel I/O Ports PSD813F1A-15JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e0

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-15JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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