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PSD813F1A-12UIT

STMicroelectronics

PSD813F1A-12UIT by STMicroelectronics

PSD813F1A-12UIT by STMicroelectronics is a low-profile, 64-terminal parallel I/O port with a max supply voltage of 5.5V and operates b/w -40 °C to 85 °C. It features 27 I/O lines and offers fast access time of 120 ns, ideal for industrial applications. Its compact design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,415

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-

-

-

Digiode

USA . 1,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

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Vyrian

USA . 1,189 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,189

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 529 parts In-Stock

1+ parts

$24.813

100+ parts

-

1k+ parts

-

10k+ parts

-

529

$24.813

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-

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IDEA Electronic Components Group

UK . 2,109 parts In-Stock

1+ parts

$26.235

100+ parts

-

1k+ parts

$23.611

10k+ parts

-

2,109

$26.235

-

$23.611

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MKK Technologies

India . 1,086 parts In-Stock

1+ parts

$49.333

100+ parts

-

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10k+ parts

-

1,086

$49.333

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-

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

$49.333

100+ parts

-

1k+ parts

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10k+ parts

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1,086

$49.333

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-

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Corphita

USA . 589 parts In-Stock

1+ parts

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589

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

-

100+ parts

$31.368

1k+ parts

-

10k+ parts

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582

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$31.368

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Overview

Unlock unparalleled performance with the PSD813F1A-12UIT from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers this versatile parallel I/O port solution designed to enhance your applications. With robust temperature resilience and compact design, it seamlessly integrates into industrial environments, ensuring reliability and efficiency. Elevate your projects while benefitting from superior support and cutting-edge technology, transforming possibilities into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy improves durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs, enhancing overall system efficiency.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this device is compatible with a broad range of power supply configurations.

Package Shape: SQUARE

The square shape ensures uniform placement on PCB, optimizing space utilization.

Power Supplies (V): 5

The standard 5V power supply is widely available and makes the device easy to integrate into existing systems.

No. of Terminals: 64

Having 64 terminals allows for multiple connections, enabling extensive functionality in data communication.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is advantageous for space-constrained applications, facilitating easier integration into smaller devices.

Minimum Supply Voltage: 4.5 V

Supporting a minimum voltage of 4.5 V extends operational flexibility, allowing for use with varying power supplies.

Maximum Operating Temperature: 85 °C

With a high operating temperature rating, this product can perform reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures expands its suitability for outdoor and challenging atmospheric conditions.

Ultraviolet Erasable: N

This feature indicates stability; the non-erasable nature implies reliable performance without unexpected data loss.

Terminal Position: QUAD

Quad terminal positioning improves connection stability and enhances signal integrity, critical for high-speed applications.

No. of Ports: 4

Four ports facilitate versatile connections, allowing multiple peripherals to interface simultaneously.

Maximum Seated Height: 1.54 mm

A low maximum seated height aids in maintaining a low profile, crucial for modern devices requiring minimal vertical clearance.

Width: 14 mm

A compact width enables easy placement in dense layouts, making it suitable for modern device designs.

Length: 14 mm

The square dimensions enhance PCB layout flexibility, making design processes more straightforward.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this component is built to endure harsh operating conditions typically found in manufacturing environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it can be used in various applications, providing versatility across different projects.

ROM Bits Size: 1310720 Bits

A large ROM size provides significant storage capabilities for configuration and programming, essential for complex functionality.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed operation, ideal for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide robust soldering connections, ensuring reliability in the physical and electrical performance of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns with standard voltage levels, enabling uncomplicated interfacing with various systems.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch suits modern PCB designs, ensuring compatibility with current manufacturing processes.

Maximum Standby Current: 0.0002 Amp

A low standby current indicates excellent power efficiency, which helps in reducing overall energy costs.

Maximum Access Time: 0.00000012 ns

Remarkably fast access time improves system responsiveness, crucial for high-speed data transmission applications.

No. of I/O Lines: 27

A total of 27 I/O lines provides extensive connectivity options, making it adaptable for various interfacing needs.

Technical Specifications

Parallel I/O Ports PSD813F1A-12UIT attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

1.54 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12UIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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