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PCA9539N

Texas Instruments

PCA9539N by Texas Instruments

PCA9539N by Texas Instruments is a 16-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features CMOS technology, operates b/w -40°C to 85°C, and has 24 terminals in an in-line package style. Suitable for general purpose use with dual terminal position and through-hole form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,668 parts In-Stock

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2,668

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Digiode

USA . 2,030 parts In-Stock

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2,030

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Distributors (Availability)

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$5.067

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417

$5.067

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One Stop Electronics

USA . 1,297 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 2,336 parts In-Stock

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$26.462

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$27.046

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2,336

$26.462

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$27.046

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DigiPath Technology Company

USA . 1,162 parts In-Stock

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$29.138

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1,162

$29.138

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IDEA Electronic Components Group

UK . 1,576 parts In-Stock

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$29.733

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$28.246

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$26.760

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1,576

$29.733

$28.246

$26.760

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ChromeModa Solutions

Germany . 1,118 parts In-Stock

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$29.733

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$24.381

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1,118

$29.733

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Corohmni

South Africa . 1,097 parts In-Stock

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$74.701

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1,097

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Corphita

USA . 2,674 parts In-Stock

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Overview

Unlock endless possibilities with the PCA9539N by Texas Instruments! This high-quality parallel I/O port device boasts 16 bits of power, making it perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile product offers customers unparalleled value and performance. Experience seamless integration, advanced technology, and reliable operation with the PCA9539N - your key to innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and ruggedness, making the product suitable for industrial applications.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

Rectangular shape offers easy mounting and integration into various electronic devices and systems.

No. of Bits: 16

16 bits allow for efficient parallel data transfer and processing, suitable for applications requiring higher data throughput.

Power Supplies (V): 2.5/5

Support for multiple power supply voltages (2.5V and 5V) enhances compatibility with different systems and power requirements.

No. of Terminals: 24

24 terminals provide sufficient connectivity options for versatile interfacing with other components and peripherals.

Package Style (Meter): IN-LINE

In-line package style offers space-saving and efficient layout design possibilities for compact electronic devices.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage ensures the product can operate efficiently even in low-power scenarios, improving energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature (85°C) allows the product to withstand harsh environmental conditions and industrial settings.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature (-40°C) ensures the product remains functional in cold environments, expanding its usability range.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, enhancing reliability in data transmission.

No. of Ports: 2

Having 2 ports allows for multiple simultaneous data transfers, increasing efficiency and throughput in parallel I/O operations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in demanding operating conditions and rugged environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port type provides versatility in interfacing with various devices and peripherals, making the product suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems for efficient data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables secure and reliable soldering connections, ensuring stable electrical connections in the device.

Nominal Supply Voltage: 3 V

Stable 3V nominal supply voltage ensures consistent and reliable operation of the product in various power supply conditions.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm facilitates easy PCB layout and soldering, ensuring compatibility and ease of integration in electronic designs.

No. of I/O Lines: 16

16 I/O lines provide sufficient input and output channels for parallel data communication, suitable for applications requiring multiple data streams.

Technical Specifications

Parallel I/O Ports PCA9539N attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

PCA9539N Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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