Loading...

PSD813F1A-12JT

STMicroelectronics

PSD813F1A-12JT by STMicroelectronics

PSD813F1A-12JT by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines and operates at a nominal voltage of 5V. It features a compact square chip carrier package and supports temperatures from 0 °C to 70 °C. Ideal for general-purpose applications, it ensures efficient data handling in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,066

-

-

-

-

Anansix

USA . 939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

939

-

-

-

-

Vyrian

USA . 882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

882

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 837 parts In-Stock

1+ parts

$23.471

100+ parts

-

1k+ parts

-

10k+ parts

-

837

$23.471

-

-

-

IDEA Electronic Components Group

UK . 306 parts In-Stock

1+ parts

$70.383

100+ parts

-

1k+ parts

$63.344

10k+ parts

-

306

$70.383

-

$63.344

-

MKK Technologies

India . 1,169 parts In-Stock

1+ parts

$132.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$132.350

-

-

-

DigiPath Technology Company

USA . 1,169 parts In-Stock

1+ parts

$132.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,169

$132.350

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Corphita

USA . 3,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,779

-

-

-

-

Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

-

100+ parts

$84.153

1k+ parts

-

10k+ parts

-

1,022

-

$84.153

-

-

Overview

Unlock a world of possibilities with the PSD813F1A-12JT from STMicroelectronics—where innovation meets reliability. This versatile Parallel I/O Port chip is designed for seamless integration, delivering exceptional performance in various applications, from consumer electronics to industrial automation. With STMicroelectronics' renowned commitment to quality and cutting-edge technology, you can trust this solution to enhance efficiency and drive your projects forward with confidence. Experience superior value and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials contributes to the longevity and robustness of the product.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB layout, making it easier to integrate into modern electronic systems.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard logic levels, allowing it to work seamlessly with most designs.

Package Shape: SQUARE

The square shape of the package aids in uniform distribution of thermal and electrical characteristics, enhancing performance.

Power Supplies (V): 5

Operating at a standard 5 V supply voltage makes this device suitable for a wide range of applications.

No. of Terminals: 52

A higher number of terminals enables more connections and functionality, offering greater flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easy handling and mounting, facilitating efficient assembly and maintenance.

Minimum Supply Voltage: 4.5 V

The ability to operate down to 4.5 V ensures versatility in power supply sources, accommodating low-voltage designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the device is suited for a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for reliable performance in standard commercial environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and improves the overall reliability of connections.

Ultraviolet Erasable: N

Not being UV erasable simplifies design considerations and enhances reliability in permanent applications.

Terminal Position: QUAD

Quad terminal positioning enables efficient signal routing and reduces interference among connections.

No. of Ports: 4

Having 4 ports provides flexibility for multiple device connections, increasing overall functionality.

Maximum Seated Height: 4.57 mm

A low seated height aids in maintaining a compact profile, making it suitable for space-constrained designs.

Width: 19.1 mm

The standard width ensures compatibility with various PCB layouts and enclosures.

Length: 19.1 mm

A consistent length allows for predictable integration into existing designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade confirms reliability for standard application scenarios, ensuring a balance between performance and cost.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose parallel I/O port, the product is versatile, suitable for a myriad of applications.

ROM Bits Size: 1310720 Bits

A large ROM bit size enhances data storage capacity, allowing for more complex operations and functionalities.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, ideal for modern electronic applications.

Terminal Form: J BEND

J-bend terminals facilitate easier soldering and improved mechanical stability when mounted.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns well with industry standards, ensuring compatibility with a wide variety of components.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch ensures compatibility with commonly used PCB hole sizes, simplifying design and assembly.

Maximum Standby Current: 0.0002 Amp

Ultra-low standby current consumption enhances energy efficiency, making it suitable for battery-powered applications.

Maximum Access Time: 0.00000012 ns

A very low maximum access time enables high-speed data retrieval, essential for performance-critical applications.

No. of I/O Lines: 27

27 I/O lines offer extensive connectivity options, enabling complex interfacing capabilities with other components.

Technical Specifications

Parallel I/O Ports PSD813F1A-12JT attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12JT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19