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PSD813F1-A-12MI

STMicroelectronics

PSD813F1-A-12MI by STMicroelectronics

PSD813F1-A-12MI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design and operates in extreme temperatures from -40 °C to 85 °C, ideal for industrial applications. With a max access time of just 120 ns, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,367 parts In-Stock

1+ parts

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1k+ parts

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4,367

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Digiode

USA . 2,629 parts In-Stock

1+ parts

-

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2,629

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Anansix

USA . 1,526 parts In-Stock

1+ parts

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1,526

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,486 parts In-Stock

1+ parts

$38.292

100+ parts

-

1k+ parts

$34.463

10k+ parts

-

1,486

$38.292

-

$34.463

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Corohmni

South Africa . 4,870 parts In-Stock

1+ parts

$48.649

100+ parts

-

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4,870

$48.649

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MKK Technologies

India . 1,558 parts In-Stock

1+ parts

$72.006

100+ parts

-

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10k+ parts

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1,558

$72.006

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DigiPath Technology Company

USA . 1,558 parts In-Stock

1+ parts

$72.006

100+ parts

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1,558

$72.006

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Corphita

USA . 1,974 parts In-Stock

1+ parts

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1,974

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Parana Technologies

USA . 842 parts In-Stock

1+ parts

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100+ parts

$45.784

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842

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$45.784

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Overview

Unlock the potential of your designs with the PSD813F1-A-12MI from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile Parallel I/O Port delivers unmatched reliability across diverse applications, from industrial automation to consumer electronics. With its robust performance and superior quality, you can enhance efficiency while reducing costs. Choose ST for excellence and empower your projects with cutting-edge technology that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating space-saving in circuit layouts.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product is compatible with a variety of standard power supplies, enhancing its versatility.

Package Shape: SQUARE

The square package shape aids in easy integration and PCB layout optimization.

Power Supplies (V): 5

Operating at a standard 5V supply makes the product widely accessible and easy to implement in existing systems.

No. of Terminals: 52

The 52-terminal configuration offers ample connectivity options for complex designs, increasing its functionality.

Package Style (Meter): FLATPACK

The flatpack style aids in efficient surface mounting, providing a low profile for the overall circuit design.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in a range of power conditions, making it reliable.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this product suitable for industrial environments.

Minimum Operating Temperature: -40 °C

A minimum operational temperature of -40 °C ensures reliability in extreme cold conditions, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and prevents corrosion, ensuring long-term reliability.

Ultraviolet Erasable: N

Not being UV erasable simplifies the design and eliminates the need for complex write/read cycles, which may be beneficial in certain applications.

Terminal Position: QUAD

The quad terminal configuration provides flexibility in design and makes it easier to connect to different board layouts.

No. of Ports: 4

Having four ports enables simultaneous connections and data transfer, enhancing efficiency in data-heavy tasks.

Maximum Seated Height: 2.35 mm

A low maximum seated height allows for compact designs and better integration into tight spaces.

Width: 10 mm

The 10 mm width is compact and easy to accommodate in various applications, contributing to space-efficient designs.

Length: 10 mm

Matching the width, the 10 mm length aids in maintaining a compact form factor, ideal for tight layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the product can withstand harsh environmental conditions, making it suitable for demanding applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port allows for versatile use in diverse applications, from simple to complex systems.

ROM Bits Size: 1310720 Bits

With a ROM bits size of 1,310,720 bits, it provides considerable storage capacity for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it suitable for modern applications.

Terminal Form: GULL WING

The gull wing terminal form provides reliable soldering and reduces stress on solder joints.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard and makes this product compatible with most circuit designs.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for dense layouts, facilitating connections without taking up excessive board space.

Maximum Standby Current: 0.0002 Amp

A low standby current enhances energy efficiency, making it an environmentally friendly choice.

Maximum Access Time: 0.00000012 ns

With an extremely fast maximum access time, this product ensures high-speed data processing capabilities.

No. of I/O Lines: 27

Having 27 I/O lines provides significant input and output capabilities, enhancing the product's versatility in various applications.

Technical Specifications

Parallel I/O Ports PSD813F1-A-12MI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD813F1-A-12MI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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