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PSD813F1A-15JIT

STMicroelectronics

PSD813F1A-15JIT by STMicroelectronics

PSD813F1A-15JIT by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square package (19.1mm) and supports industrial applications with a max temp of 85 °C. Ideal for general-purpose interfacing in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,592 parts In-Stock

1+ parts

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3,592

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Anansix

USA . 2,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,720

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Digiode

USA . 219 parts In-Stock

1+ parts

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219

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,192 parts In-Stock

1+ parts

$35.077

100+ parts

-

1k+ parts

-

10k+ parts

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3,192

$35.077

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$38.346

100+ parts

-

1k+ parts

$34.511

10k+ parts

-

1,695

$38.346

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$34.511

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MKK Technologies

India . 1,044 parts In-Stock

1+ parts

$72.106

100+ parts

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1,044

$72.106

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DigiPath Technology Company

USA . 1,044 parts In-Stock

1+ parts

$72.106

100+ parts

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1,044

$72.106

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Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

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100+ parts

$45.848

1k+ parts

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1,744

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$45.848

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Corphita

USA . 1,404 parts In-Stock

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1,404

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Overview

Unlock unparalleled performance and reliability with the PSD813F1A-15JIT from STMicroelectronics, a leader in semiconductor innovation. This robust parallel I/O port is designed to excel in industrial applications, ensuring seamless data handling under extreme temperatures. With its compact design and efficient power consumption, it offers exceptional value, enabling your projects to thrive while minimizing costs. Trust in STMicroelectronics' quality and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for compact design, enabling easier integration into modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for use in various electronic applications without risking damage.

Package Shape: SQUARE

The square shape allows for efficient use of PCB space and simplifies layout designs.

Power Supplies (V): 5

Standard 5 V power supply voltage ensures compatibility with a wide range of existing systems.

No. of Terminals: 52

With 52 terminals, the product offers expansive connectivity options for complex applications.

Package Style (Meter): CHIP CARRIER

Chip carrier style facilitates easy mounting and replaces bulky traditional packages, saving space in circuit designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V provides operational reliability across a range of power supply variations.

Maximum Operating Temperature: 85 °C

An operational temperature limit of 85 °C ensures reliable performance in industrial environments.

Minimum Operating Temperature: -40 °C

The product’s functionality at -40 °C guarantees performance in extreme conditions, suitable for outdoor and harsh environments.

Terminal Finish: Matte Tin (Sn)

Matte tin finish improves solderability and enhances long-term reliability of electronic connections.

Ultraviolet Erasable: N

Non-erasable characteristics imply stable data retention, suitable for applications requiring reliable data storage.

Terminal Position: QUAD

Quad terminal positioning allows for versatile routing options and improved connection density on a PCB.

No. of Ports: 4

With 4 ports available, this device can manage multiple I/O operations simultaneously, increasing efficiency.

Maximum Seated Height: 4.57 mm

A low seated height facilitates compact designs and space-saving placements within electronic assemblies.

Width: 19.1 mm

The compact width results in minimized space usage on PCB layouts, enabling denser designs.

Length: 19.1 mm

A similar length to width ratio maintains a consistent footprint that simplifies integration into existing systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it ensures reliable performance even in challenging manufacturing environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O capabilities make this IC flexible for a wide variety of applications.

ROM Bits Size: 1310720 Bits

A sizable ROM capability supports extensive data storage, accommodating complex program requirements.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it advantageous for modern applications.

Terminal Form: J BEND

J bend terminals simplify the soldering process and provide optimal mechanical stability once mounted.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V maximizes compatibility while ensuring stable operation across diverse systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes an ideal balance between density and ease of soldering for standard applications.

Maximum Standby Current: 0.0002 Amp

Low standby current enhances energy efficiency, which is crucial for battery-operated devices.

Maximum Access Time: 0.00000015 ns

Extremely fast access time ensures high-speed data retrieval, making this product suitable for performance-sensitive applications.

No. of I/O Lines: 27

27 I/O lines provide extensive interfacing options, ideal for applications requiring extensive data handling.

Technical Specifications

Parallel I/O Ports PSD813F1A-15JIT attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-15JIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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