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PSD813F1A-12JIT

STMicroelectronics

PSD813F1A-12JIT by STMicroelectronics

PSD813F1A-12JIT by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports industrial applications with a max temp of 85 °C. Ideal for general-purpose interfacing in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,821 parts In-Stock

1+ parts

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2,821

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Vyrian

USA . 2,317 parts In-Stock

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2,317

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Anansix

USA . 233 parts In-Stock

1+ parts

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233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$22.437

100+ parts

-

1k+ parts

$20.193

10k+ parts

-

604

$22.437

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$20.193

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Corohmni

South Africa . 2,122 parts In-Stock

1+ parts

$27.358

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2,122

$27.358

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MKK Technologies

India . 1,714 parts In-Stock

1+ parts

$42.191

100+ parts

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1,714

$42.191

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DigiPath Technology Company

USA . 1,714 parts In-Stock

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$42.191

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1,714

$42.191

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Parana Technologies

USA . 1,837 parts In-Stock

1+ parts

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100+ parts

$26.827

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1,837

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$26.827

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Corphita

USA . 354 parts In-Stock

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354

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Overview

Unlock the potential of your projects with the PSD813F1A-12JIT from STMicroelectronics, a leader in semiconductor innovation. This robust parallel I/O port solution ensures reliable performance across diverse applications, from industrial automation to consumer electronics. With its compact design and exceptional temperature resilience, it seamlessly integrates into your systems, offering unmatched quality and efficiency that enhances productivity while driving down costs. Embrace the future of connectivity and experience the STMicroelectronics advantage!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space on PCBs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard circuit designs without risking damage.

Package Shape: SQUARE

The square package shape facilitates easier integration into circuit layouts and optimizes PCB space.

Power Supplies (V): 5

Operating at a 5V power supply aligns with common voltage levels in digital electronics, making it practical for widespread use.

No. of Terminals: 52

With 52 terminals, this product can support multiple connections, enhancing its versatility for complex applications.

Package Style (Meter): CHIP CARRIER

Chip carrier style allows for efficient thermal management and performance in compact systems.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation across a range of power supply scenarios.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, this component is suited for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product ideal for extreme conditions, enhancing its reliability.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Ultraviolet Erasable: N

Not UV erasable, which simplifies the design as the focus is on reliability and performance over erasability.

Terminal Position: QUAD

Quad terminal positioning enhances connection efficiency and facilitates multi-line data transmissions.

No. of Ports: 4

With four parallel I/O ports, it allows simultaneous data transfer, increasing the efficiency of data handling.

Maximum Seated Height: 4.57 mm

The low seated height achieves a low profile in design, contributing to compactness in electronic assemblies.

Width: 19.1 mm

The compact width supports space-saving designs, suitable for modern electronic applications.

Length: 19.1 mm

A square form factor of 19.1 mm allows for balanced placement and predictable performance on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product assures reliability and performance in demanding environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O capabilities make this component versatile for a variety of applications.

ROM Bits Size: 1310720 Bits

Large ROM bit size allows for extensive data storage, making this product suitable for complex applications.

Technology: CMOS

CMOS technology offers low power consumption along with high speed and reliability in operation.

Terminal Form: J BEND

J bend terminals facilitate easy manual insertion or automated pick and place during manufacturing.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V keeps the product compatible with most digital systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact designs while ensuring reliable connections.

Maximum Standby Current: 0.0002 Amp

Low standby current minimizes power consumption, aligning with energy-efficient design requirements.

Maximum Access Time: 0.12 ns

Fast access time ensures quick data retrieval, crucial for high-speed applications.

No. of I/O Lines: 27

With 27 I/O lines, this product provides ample connections for complex configurations and data handling.

Technical Specifications

Parallel I/O Ports PSD813F1A-12JIT attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12JIT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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