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PCF8575CPWRG4

Texas Instruments

PCF8575CPWRG4 by Texas Instruments

PCF8575CPWRG4 by Texas Instruments is a 16-bit parallel I/O port with 2 ports, operating at 5V. It features CMOS technology, industrial temperature grade, and dual terminal position. Widely used in applications requiring general-purpose parallel I/O interfacing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,602 parts In-Stock

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3,602

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Vyrian

USA . 1,939 parts In-Stock

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1,939

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$15.670

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648

$15.670

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Ampacity Inc.

Singapore . 1,422 parts In-Stock

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$19.000

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1,422

$19.000

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One Stop Electronics

USA . 912 parts In-Stock

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$32.000

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912

$32.000

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Corohmni

South Africa . 1,938 parts In-Stock

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$60.053

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1,938

$60.053

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Parana Technologies

USA . 761 parts In-Stock

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$76.793

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761

$76.793

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ChromeModa Solutions

Germany . 1,542 parts In-Stock

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$86.284

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$70.753

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$86.284

$70.753

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IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$86.284

100+ parts

$81.970

1k+ parts

$77.656

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450

$86.284

$81.970

$77.656

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Continental Prestige Electronics

USA . 6,998 parts In-Stock

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Corphita

USA . 4,614 parts In-Stock

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Argo Parts USA

USA . 1,479 parts In-Stock

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DigiPath Technology Company

USA . 338 parts In-Stock

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$77.794

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338

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$77.794

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of seamless connectivity with the Texas Instruments PCF8575CPWRG4, a high-quality Parallel I/O Ports device designed to enhance your electronic projects. With Texas Instrument's reputation for excellence in manufacturing, this versatile component offers unmatched reliability and performance. Ideal for a wide range of applications, this product provides customers with the value, benefits, and advantages they need to bring their creations to life. Experience the difference with Texas Instruments PCF8575CPWRG4.

Feature Benefit Bullets

Body Material

PLASTIC/EPOXY. This lightweight yet durable material makes the product suitable for various applications.

Surface Mount

YES. Easy installation and compact design make this product convenient for use in tight spaces.

Maximum Supply Voltage

5.5 V. Provides a wide range of voltage tolerance for compatibility with different systems.

Package Shape

RECTANGULAR. The shape allows for efficient use of space on a circuit board.

No. of Bits

16. Offers high data processing capability for enhanced performance.

Power Supplies (V)

5. Provides stable and reliable power to ensure consistent operation.

No. of Terminals

24. Offers flexibility in connections for versatile integration.

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. The compact package style saves space and allows for dense packing of components.

Minimum Supply Voltage

4.5 V. Can operate efficiently even under low voltage conditions.

Maximum Operating Temperature

85 °C. Can withstand high temperatures to ensure reliable performance in various environments.

Minimum Operating Temperature

40 °C. Capable of operating in extreme cold conditions without affecting functionality.

Terminal Finish

NICKEL PALLADIUM GOLD. Ensures corrosion resistance and reliable connections for long-term use.

Terminal Position

DUAL. Allows for versatile positioning options depending on the application requirements.

No. of Ports

2. Provides additional connectivity options for enhanced functionality.

Maximum Seated Height

1.2 mm. Low profile design ensures compatibility with slim devices.

Width

4.4 mm. Compact width allows for efficient use of space on a circuit board.

Maximum Time At Peak Reflow Temperature (s)

30. Allows for quick and effective soldering during manufacturing processes.

Peak Reflow Temperature °C

260. Can withstand high temperatures during soldering without affecting performance.

Length

7.8 mm. Provides a balance between compact size and functionality.

Temperature Grade

INDUSTRIAL. Suitable for use in industrial environments with varying temperature conditions.

Peripheral IC Type

PARALLEL IO PORT, GENERAL PURPOSE. Versatile IC type suitable for a wide range of applications.

Technology

CMOS. Offers low power consumption and high noise immunity for efficient operation.

Terminal Form

GULL WING. Provides a secure mounting option for reliable connections.

Nominal Supply Voltage

5 V. Standard voltage supply for compatibility with a wide range of systems.

Terminal Pitch

0.65 mm. Fine pitch design allows for high-density mounting on a circuit board.

No. of I/O Lines

16. Sufficient I/O lines for versatile connectivity options in a range of applications.

Technical Specifications

Parallel I/O Ports PCF8575CPWRG4 attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Parallel IO Ports

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

PCF8575CPWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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