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PSD813F1A-15J1

STMicroelectronics

PSD813F1A-15J1 by STMicroelectronics

STMicroelectronics' PSD813F1A-15J1 is a CMOS technology chip carrier with 27 I/O lines, 4 ports, and quad terminal position. Operating b/w 0 to 70 °C, it's ideal for commercial applications requiring parallel I/O ports in a compact 19.1mm square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,903 parts In-Stock

1+ parts

-

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3,903

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Vyrian

USA . 1,946 parts In-Stock

1+ parts

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1,946

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Anansix

USA . 550 parts In-Stock

1+ parts

-

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$17.706

100+ parts

-

1k+ parts

$15.936

10k+ parts

-

2,110

$17.706

-

$15.936

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MKK Technologies

India . 181 parts In-Stock

1+ parts

$33.296

100+ parts

-

1k+ parts

-

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181

$33.296

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DigiPath Technology Company

USA . 181 parts In-Stock

1+ parts

$33.296

100+ parts

-

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181

$33.296

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Corohmni

South Africa . 540 parts In-Stock

1+ parts

$69.127

100+ parts

-

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10k+ parts

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540

$69.127

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

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Parana Technologies

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

$21.171

1k+ parts

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2,187

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$21.171

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Corphita

USA . 1,965 parts In-Stock

1+ parts

-

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1,965

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Overview

Discover the PSD813F1A-15J1 by STMicroelectronics, a high-quality Parallel I/O Ports chip carrier designed to elevate your electronic projects. With a wide range of applications, this versatile component offers unparalleled value and benefits to customers seeking reliable performance and ease of use. Trust in the reputation of STMicroelectronics for cutting-edge technology and superior manufacturing, and unlock endless possibilities with the PSD813F1A-15J1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Provides compatibility with a wide range of devices and power sources, increasing flexibility in usage.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the circuit board.

No. of Terminals: 52

Offers ample connectivity options, allowing for versatile integration within different systems.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and reliability, ensuring optimal operation of the product.

Minimum Operating Temperature: 0 °C

Can withstand low-temperature environments, ensuring reliable performance in various conditions.

No. of Ports: 4

Provides multiple ports for connecting various external devices, increasing the product's utility and versatility.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed for general-purpose parallel I/O operations, making it suitable for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources, ensuring easy integration with existing systems.

No. of I/O Lines: 27

Offers a large number of I/O lines for versatile data communication and interfacing capabilities.

Technical Specifications

Parallel I/O Ports PSD813F1A-15J1 attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J52

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-15J1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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