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PSD813F1A-12J

STMicroelectronics

PSD813F1A-12J by STMicroelectronics

PSD813F1A-12J by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact square chip carrier package and supports commercial temperature ranges up to 70 °C. Ideal for general-purpose applications requiring efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,881 parts In-Stock

1+ parts

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4,881

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Anansix

USA . 2,501 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,501

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Digiode

USA . 2,185 parts In-Stock

1+ parts

-

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2,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$34.783

100+ parts

-

1k+ parts

$31.305

10k+ parts

-

572

$34.783

-

$31.305

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Corohmni

South Africa . 791 parts In-Stock

1+ parts

$60.305

100+ parts

-

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791

$60.305

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MKK Technologies

India . 916 parts In-Stock

1+ parts

$65.408

100+ parts

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916

$65.408

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DigiPath Technology Company

USA . 916 parts In-Stock

1+ parts

$65.408

100+ parts

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916

$65.408

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Parana Technologies

USA . 1,961 parts In-Stock

1+ parts

-

100+ parts

$41.589

1k+ parts

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1,961

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$41.589

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Corphita

USA . 599 parts In-Stock

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599

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Overview

Unlock limitless possibilities with the PSD813F1A-12J from STMicroelectronics, a leader in innovation and reliability. This versatile parallel I/O port seamlessly integrates into your projects, enhancing performance while ensuring energy efficiency. With its compact design and robust temperature tolerance, it’s ideal for everything from consumer electronics to industrial applications. Experience unmatched quality and support from a trusted manufacturer, empowering you to create cutting-edge solutions effortlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs, leading to smaller overall designs.

Maximum Supply Voltage: 5.5 V

This flexibility in supply voltage allows the product to function in different environments without compromising performance.

Package Shape: SQUARE

The square shape helps with systematic layout on PCBs, minimizing interference and optimizing integration.

Power Supplies (V): 5

Operating at a standard 5V makes it compatible with a wide range of systems and devices.

No. of Terminals: 52

The large number of terminals provides extensive connectivity options, fostering versatile applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style accommodates ease of manufacturing and integration into electronic systems.

Minimum Supply Voltage: 4.5 V

The minimum supply range allows for use in diverse applications even under low voltage conditions.

Maximum Operating Temperature: 70 °C

A high operating temperature threshold ensures reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to function from freezing temperatures adds to the versatility of use in varied climates.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and long-term reliability of the connection.

Ultraviolet Erasable: N

Not being UV erasable contributes to ease of use in permanent configuration settings.

Terminal Position: QUAD

Quad terminal positioning facilitates organized connectivity and efficient routing on PCB layouts.

No. of Ports: 4

Four ports allow for multiple simultaneous data channels, improving overall system efficiency.

Maximum Seated Height: 4.57 mm

The low seated height makes it suitable for compact designs while maintaining functionality.

Width: 19.1 mm

The standardized width helps in space-efficient layouts and accommodates flexible integration.

Length: 19.1 mm

A uniform length contributes to ease of alignment and installation in various applications.

Temperature Grade: COMMERCIAL

Commercial grade classification ensures reliability in general usage environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port broadens its usability across different projects.

ROM Bits Size: 1310720 Bits

The substantial ROM size allows for extensive data storage, enhancing functionality.

Technology: CMOS

CMOS technology contributes to low power consumption and high efficiency in operation.

Terminal Form: J BEND

J-bend terminal form facilitates easier mounting and soldering, improving manufacturing processes.

Nominal Supply Voltage: 5 V

Running at a nominal 5V optimizes performance while ensuring compatibility across systems.

Terminal Pitch: 1.27 mm

Fine pitch terminal design supports high density packaging without sacrificing performance.

Maximum Standby Current: 0.0002 Amp

Low standby current enhances energy efficiency, making it eco-friendly and cost-effective.

Maximum Access Time: 0.00000012 ns

Very fast access time guarantees rapid data retrieval, essential for high-speed applications.

No. of I/O Lines: 27

Having 27 I/O lines increases the complexity and capability of the device to handle multiple tasks simultaneously.

Technical Specifications

Parallel I/O Ports PSD813F1A-12J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD813F1A-12J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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