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PCF8575TSDB

NXP Semiconductors

PCF8575TSDB by NXP Semiconductors

PCF8575TSDB by NXP Semiconductors is a 16-bit parallel I/O port with supply voltage range of 2.5-5.5V, operating temperature from -40 to 85°C. It features small outline package style for industrial applications requiring general purpose parallel I/O functionality.

Median Price

$0.700

Lifecycle Status

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1k+

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Verical

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DF Sales Co.

USA . 330 parts In-Stock

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DF Sales Co.

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Anansix

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Nova Conductors

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Connector Distribution Corp

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Right Parts Inc.

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Electronic Expediters

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ComSIT Distribution GmbH

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Semicontronic

India . 849 parts In-Stock

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$0.975

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Ampacity Inc.

Singapore . 242 parts In-Stock

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AZTECH Wire

Italy . 797 parts In-Stock

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Corohmni

South Africa . 220 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Enhance your electronic projects with the high-quality PCF8575TSDB by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers superior parallel I/O ports that offer versatility and reliability. This small outline, shrink pitch package provides 16 bits of power across 24 terminals, making it perfect for a variety of industrial applications. With a wide operating temperature range and nickel palladium gold terminal finish, this product ensures durability and performance. Upgrade your designs today with the PCF8575TSDB and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Easy installation and space-saving design make this product suitable for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, providing flexibility for various power requirements.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient component layout on circuit boards.

No. of Bits: 16

16-bit configuration enables high-speed data transfer and processing capabilities.

Power Supplies (V): 3/5

Ability to work with both 3V and 5V power supplies ensures compatibility with different systems.

No. of Terminals: 24

Sufficient number of terminals for connecting multiple devices and peripherals.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design with small outline and shrink pitch for space-constrained applications.

Minimum Supply Voltage: 2.5 V

Supports low voltage operation for energy-efficient performance.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stable operation in various environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish for enhanced conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board placement.

Maximum Seated Height: 2 mm

Low seated height for compact design and efficient space utilization.

Width: 5.3 mm

Slim width for fitting into tight spaces on electronic PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Supports quick and efficient soldering processes in manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering connections.

Length: 8.2 mm

Optimal length for easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile peripheral IC type suitable for a wide range of parallel input/output applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed data processing.

Terminal Form: GULL WING

Gull-wing terminal form for secure and reliable connections on PCBs.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise soldering and connectivity.

No. of I/O Lines: 16

16 I/O lines for efficient data transfer and connectivity with external devices.

Technical Specifications

Parallel I/O Ports PCF8575TSDB attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

PCF8575TSDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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