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PCA9534ADWT

Texas Instruments

PCA9534ADWT by Texas Instruments

PCA9534ADWT by Texas Instruments is a CMOS technology parallel I/O port with 8 I/O lines. It operates b/w -40 to 85 °C, with supply voltage range of 2.3V to 5.5V. Widely used in industrial applications for general purpose parallel I/O interfacing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Digiode

USA . 2,330 parts In-Stock

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2,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 529 parts In-Stock

1+ parts

$5.020

100+ parts

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529

$5.020

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One Stop Electronics

USA . 367 parts In-Stock

1+ parts

$9.000

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-

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367

$9.000

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Corohmni

South Africa . 754 parts In-Stock

1+ parts

$52.884

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754

$52.884

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Parana Technologies

USA . 2,254 parts In-Stock

1+ parts

$76.481

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2,254

$76.481

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DigiPath Technology Company

USA . 2,053 parts In-Stock

1+ parts

$84.215

100+ parts

$77.478

1k+ parts

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2,053

$84.215

$77.478

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ChromeModa Solutions

Germany . 4,594 parts In-Stock

1+ parts

$85.934

100+ parts

$70.466

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4,594

$85.934

$70.466

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IDEA Electronic Components Group

UK . 893 parts In-Stock

1+ parts

$85.934

100+ parts

$81.637

1k+ parts

$77.341

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893

$85.934

$81.637

$77.341

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Corphita

USA . 2,161 parts In-Stock

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2,161

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Overview

Enhance your electronic projects with the PCA9534ADWT by Texas Instruments, a leading manufacturer known for its top-quality components. This Parallel I/O Ports device offers endless possibilities for customization and control, making it perfect for a wide range of applications. With its small outline package, industrial-grade temperature rating, and versatile CMOS technology, this product delivers unparalleled performance and reliability. Experience the convenience and efficiency that the PCA9534ADWT brings to your designs, unlocking new levels of innovation and success. Upgrade your projects today with this exceptional component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY for the package body material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power requirements and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient use of board space and facilitates proper alignment during assembly.

No. of Terminals: 16

With 16 terminals, this product can support a variety of connections and functions, making it versatile for different applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 to 85°C ensures reliable performance in harsh environmental conditions.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, contributing to efficient operation and signal integrity.

Technical Specifications

Parallel I/O Ports PCA9534ADWT attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

PCA9534ADWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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