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PCA9539RHLR

Texas Instruments

PCA9539RHLR by Texas Instruments

PCA9539RHLR by Texas Instruments is a 16-bit parallel I/O port with supply voltage range of 2.3V to 5.5V, ideal for industrial applications. It features CMOS technology, operates b/w -40°C to 85°C, and has a compact chip carrier package style. Suitable for general purpose use with 2 ports and no lead terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,334 parts In-Stock

1+ parts

-

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8,334

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Digiode

USA . 3,750 parts In-Stock

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3,750

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Distributors (Availability)

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One Stop Electronics

USA . 298 parts In-Stock

1+ parts

$3.000

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-

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298

$3.000

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AZTECH Wire

Italy . 482 parts In-Stock

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$12.158

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482

$12.158

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Parana Technologies

USA . 144 parts In-Stock

1+ parts

$18.661

100+ parts

$1,732.923

1k+ parts

$16.795

10k+ parts

-

144

$18.661

$1,732.923

$16.795

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DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$20.548

100+ parts

$18.904

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-

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2,120

$20.548

$18.904

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ChromeModa Solutions

Germany . 6,990 parts In-Stock

1+ parts

$20.967

100+ parts

$17.193

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6,990

$20.967

$17.193

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IDEA Electronic Components Group

UK . 2 parts In-Stock

1+ parts

$20.967

100+ parts

$19.919

1k+ parts

$18.870

10k+ parts

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2

$20.967

$19.919

$18.870

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Corohmni

South Africa . 1,018 parts In-Stock

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$63.143

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1,018

$63.143

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Corphita

USA . 630 parts In-Stock

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630

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Kepictronics

USA . 105 parts In-Stock

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105

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Overview

Unlock the power of efficient and versatile parallel I/O ports with the Texas Instruments PCA9539RHLR. With a reputation for top-notch quality and reliability, Texas Instruments delivers a cutting-edge solution for your project needs. This chip carrier, heat sink/slug package offers 16 bits of I/O lines with a wide temperature range, making it ideal for industrial applications. Experience seamless integration and enhanced functionality with the PCA9539RHLR, providing value and performance that customers can rely on. Elevate your design with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and power sources.

No. of Bits: 16

Having 16 bits allows for high-speed data transfer and processing capabilities, suitable for handling large amounts of data.

Minimum Operating Temperature: -40°C

The wide range of operating temperatures makes the product suitable for use in extreme environmental conditions.

Width: 3.5 mm

The compact width of the product makes it ideal for applications where space is limited, such as in small electronic devices.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Parallel I/O Ports PCA9539RHLR attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N24

Length:

5.5 mm

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24/28,.14X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Peripheral IC Type:

Trade Compliance

PCA9539RHLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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