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PCA9555DBQ

Texas Instruments

PCA9555DBQ by Texas Instruments

PCA9555DBQ by Texas Instruments is a 16-bit parallel I/O port with 2.3V to 5.5V supply voltage range, ideal for industrial applications. It features 8 I/O lines, CMOS technology, and operates b/w -40°C to 85°C temperature range. The small outline package with gull wing terminals makes it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,846 parts In-Stock

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4,846

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Digiode

USA . 2,116 parts In-Stock

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2,116

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$14.169

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836

$14.169

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Semicontronic

India . 1,531 parts In-Stock

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$32.000

100+ parts

$31.200

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$31.040

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1,531

$32.000

$31.200

$31.040

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

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$33.000

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$33.000

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One Stop Electronics

USA . 1,258 parts In-Stock

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$33.000

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1,258

$33.000

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Parana Technologies

USA . 1,281 parts In-Stock

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$70.789

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$70.789

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DigiPath Technology Company

USA . 2,325 parts In-Stock

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$77.947

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$77.947

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Corohmni

South Africa . 2,052 parts In-Stock

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$78.417

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2,052

$78.417

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ChromeModa Solutions

Germany . 4,654 parts In-Stock

1+ parts

$79.538

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$65.221

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4,654

$79.538

$65.221

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

1+ parts

$79.538

100+ parts

$75.561

1k+ parts

$71.584

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1,037

$79.538

$75.561

$71.584

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Continental Prestige Electronics

USA . 5,091 parts In-Stock

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Corphita

USA . 4,705 parts In-Stock

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Argo Parts USA

USA . 4,382 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock endless possibilities with the PCA9555DBQ by Texas Instruments. This versatile Parallel I/O Port device offers unparalleled quality and reliability, backed by the reputable manufacturer's commitment to excellence. From industrial automation to consumer electronics, this product is the key to seamless integration and efficient operation. Experience the value and benefits of Texas Instruments technology with the PCA9555DBQ - where innovation meets practicality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

This feature allows for easy installation and saves space on PCB.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product is compatible with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on a circuit board.

No. of Bits: 16

Offering 16 bits provides a high level of data processing capability.

Power Supplies (V): 2.5/5

This versatile product can operate on 2.5V or 5V power supplies.

No. of Terminals: 24

The 24 terminals ensure connectivity with various external devices.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch make this product suitable for compact designs.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage allows for efficient power consumption.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is suitable for use in extreme conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slim profile in design.

Width: 3.9 mm

The compact width of 3.9mm enables efficient use of PCB space.

Length: 8.65 mm

The length of 8.65mm offers a balanced form factor for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh working environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This product is versatile and can be used for various general-purpose applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable connections.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures compatibility with common power sources.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for dense packing on the PCB.

No. of I/O Lines: 8

With 8 I/O lines, this product offers sufficient connectivity options for various applications.

Technical Specifications

Parallel I/O Ports PCA9555DBQ attributes and parameters. Explore more Parallel I/O Ports devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

No. of Bits:

16

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

PCA9555DBQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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