Loading...

M34E02-FMB6TP

STMicroelectronics

M34E02-FMB6TP by STMicroelectronics

The STMicroelectronics M34E02-FMB6TP is an EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. It operates in industrial temperature grades (-40 to 85 °C) and offers write protection via hardware/software. Ideal for applications requiring reliable non-volatile memory storage with up to 1000000 write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,319

-

-

-

-

Digiode

USA . 2,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,677

-

-

-

-

Anansix

USA . 492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

492

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,246 parts In-Stock

1+ parts

$4.323

100+ parts

-

1k+ parts

$3.891

10k+ parts

-

1,246

$4.323

-

$3.891

-

MKK Technologies

India . 659 parts In-Stock

1+ parts

$8.129

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$8.129

-

-

-

DigiPath Technology Company

USA . 659 parts In-Stock

1+ parts

$8.129

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$8.129

-

-

-

Corphita

USA . 4,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,215

-

-

-

-

Parana Technologies

USA . 2,144 parts In-Stock

1+ parts

-

100+ parts

$5.169

1k+ parts

-

10k+ parts

-

2,144

-

$5.169

-

-

Overview

Unlock the power of reliable data storage with the M34E02-FMB6TP by STMicroelectronics, a top-tier manufacturer known for its quality and innovation. This EEPROM device offers unparalleled value with its durable plastic/epoxy package, small outline design, and industrial-grade temperature range. Ideal for a wide range of applications, this product boasts 1000000 write/erase cycles, ensuring long-lasting performance. Whether you need hardware or software write protection, this versatile solution provides the flexibility and reliability you need. Upgrade your systems today with the M34E02-FMB6TP and experience the difference in data storage excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures the package can withstand harsh environments, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing overall product size.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor that is easy to integrate into existing designs.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for higher density layouts.

Maximum Operating Temperature: 85 °C

Wide maximum operating temperature range ensures reliability in various environmental conditions.

Organization: 256X8

Organized as 256 words of 8 bits each, allowing for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures reliable performance even in extreme cold conditions.

I2C Control Byte: 1010DDDR

Supports I2C interface with a control byte format that enables easy communication with other devices on the bus.

Terminal Position: DUAL

Dual terminal position design allows for versatile mounting options and ease of connection.

Write Protection: HARDWARE/SOFTWARE

Offers both hardware and software write protection options for secure data storage and prevention of accidental data loss.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with reliable performance in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Parallel or Serial: SERIAL

Serial interface allows for easy integration with microcontrollers and other serial devices.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations.

Maximum Supply Current: 3 mA

Low maximum supply current consumption for energy-efficient operation.

No. of Words: 256 words

Provides ample storage capacity with 256 words for storing data.

Memory Width: 8

8-bit memory width allows for efficient data processing and storage.

Minimum Data Retention Time: 40

Ensures data integrity with a minimum data retention time of 40 years.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density mounting on PCBs.

No. of Words Code: 256

Supports 256 words of code for programming and storing instructions.

Endurance: 1000000 Write/Erase Cycles

High endurance rating of 1,000,000 write/erase cycles for reliable and long-lasting performance.

Serial Bus Type: I2C

Supports I2C serial bus communication for easy integration with a wide range of devices.

Memory Density: 2048 bit

High memory density of 2048 bits for storing a large amount of data in a compact form factor.

Memory IC Type: EEPROM

Uses EEPROM memory technology for non-volatile data storage and easy data retrieval.

Maximum Standby Current: 0.000001 Amp

Ultra-low maximum standby current consumption for energy efficiency in power-saving modes.

Technical Specifications

EEPROM M34E02-FMB6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FMB6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19