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M34E02-FDW1TP

STMicroelectronics

M34E02-FDW1TP by STMicroelectronics

M34E02-FDW1TP by STMicroelectronics is a 2048-bit EEPROM with a compact SOIC package, operating at 2.5V and supporting I2C communication. It features a max clock frequency of 400 kHz and offers hardware/software write protection. Ideal for consumer electronics, it ensures reliable data retention with up to 1M write/erase cycles.

Median Price

$0.290

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,394 parts In-Stock

1+ parts

$0.290

100+ parts

$0.260

1k+ parts

$0.241

10k+ parts

$0.224

8,394

$0.290

$0.260

$0.241

$0.224

Mouser Electronics

USA . 2,102 parts In-Stock

1+ parts

$0.290

100+ parts

$0.259

1k+ parts

$0.240

10k+ parts

$0.229

2,102

$0.290

$0.259

$0.240

$0.229

Arrow

USA . 572 parts In-Stock

1+ parts

$0.463

100+ parts

$0.442

1k+ parts

$0.427

10k+ parts

-

572

$0.463

$0.442

$0.427

-

Future Electronics

Canada . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.087

40,000

-

-

-

$0.087

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Chip1Stop

Japan . 1,572 parts In-Stock

1+ parts

-

100+ parts

$0.127

1k+ parts

-

10k+ parts

-

1,572

-

$0.127

-

-

Verical

USA . 572 parts In-Stock

1+ parts

-

100+ parts

$0.442

1k+ parts

$0.427

10k+ parts

-

572

-

$0.442

$0.427

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,321 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

-

10k+ parts

-

2,321

$0.084

-

-

-

Digiode

USA . 2,189 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

$0.190

-

-

-

IBS Electronics

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.113

40,000

-

-

-

$0.113

R&J Components

USA . 28,099 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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28,099

-

-

-

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Quantum Digital Technology

USA . 8,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,273

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-

-

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A&K Electronics

USA . 5,912 parts In-Stock

1+ parts

-

100+ parts

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5,912

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-

-

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Rotakorn

Sweden . 5,912 parts In-Stock

1+ parts

-

100+ parts

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5,912

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-

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Bristol Electronics

USA . 5,912 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,912

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-

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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LIBRA Elektronik GmbH

Germany . 2,627 parts In-Stock

1+ parts

-

100+ parts

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2,627

-

-

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Anansix

USA . 2,455 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,455

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-

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Prism Electronics

USA . 1,593 parts In-Stock

1+ parts

-

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1,593

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-

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ACDS - Activité Composants Distribution Service

France . 1,231 parts In-Stock

1+ parts

-

100+ parts

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1,231

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-

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Dan-Mar Components

USA . 1,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,231

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,664 parts In-Stock

1+ parts

$0.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,664

$0.180

-

-

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IDEA Electronic Components Group

UK . 411 parts In-Stock

1+ parts

$5.273

100+ parts

-

1k+ parts

$4.746

10k+ parts

-

411

$5.273

-

$4.746

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$6.596

100+ parts

$6.002

1k+ parts

$5.409

10k+ parts

-

500

$6.596

$6.002

$5.409

-

MKK Technologies

India . 955 parts In-Stock

1+ parts

$9.916

100+ parts

-

1k+ parts

-

10k+ parts

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955

$9.916

-

-

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DigiPath Technology Company

USA . 955 parts In-Stock

1+ parts

$9.916

100+ parts

-

1k+ parts

-

10k+ parts

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955

$9.916

-

-

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Kepictronics

USA . 50,000 parts In-Stock

1+ parts

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50,000

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Perfect Parts

USA . 11,315 parts In-Stock

1+ parts

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11,315

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-

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Eastek

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.200

10k+ parts

-

4,000

-

-

$0.200

-

A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,400

-

-

-

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Parana Technologies

USA . 2,127 parts In-Stock

1+ parts

-

100+ parts

$6.305

1k+ parts

-

10k+ parts

-

2,127

-

$6.305

-

-

Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

Overview

Unlock the potential of your designs with the M34E02-FDW1TP EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact and reliable memory solution offers exceptional endurance and flexibility, perfect for a wide array of applications, from consumer electronics to industrial automation. With robust write protection and efficient power management, it ensures data integrity while minimizing energy consumption—empowering your projects with quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material provides durability and environmental resistance, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly on printed circuit boards (PCBs), optimizing space and manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout on PCB and offers versatile mounting options.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall performance in communication applications.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V ensures compatibility with low-power devices, making it an energy-efficient choice.

Power Supplies (V): 1.8/3.3

Support for multiple supply voltages (1.8V and 3.3V) enhances flexibility in various electronic designs.

No. of Terminals: 8

The compact design with 8 terminals simplifies board design and keeps footprint minimal while providing sufficient connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline fit well in space-constrained applications without compromising performance.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable operation in consumer and commercial environments.

Organization: 256X8

The memory organization of 256x8 bits provides a good balance between memory size and access speed, suitable for many applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this EEPROM is adaptable to standard operating environments without risk of malfunction.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium gold finish enhances reliability and solderability, ensuring strong connections and prolonged durability.

I2C Control Byte: 1010DDDR

The I2C control byte configuration allows easy interfacing with microcontrollers, enabling simple integration into systems.

Terminal Position: DUAL

Dual terminal positioning improves physical mounting stability and flexibility in PCB design.

Write Protection: HARDWARE/SOFTWARE

Dual write protection mechanisms safeguard data integrity, making it suitable for applications requiring high reliability.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm allows for low-profile designs, essential for modern compact electronics.

Maximum Clock Frequency (fCLK): 0.4 MHz

A 0.4 MHz maximum clock frequency ensures sufficient speed for data transfer in light computing tasks.

Width: 3 mm

With a width of 3 mm, this EEPROM is compact and can fit into tight spaces usually found in modern electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage of 1.7V supports low-power designs, enhancing energy efficiency in portable devices.

Length: 4.4 mm

A length of 4.4 mm allows for a highly compact design, which is beneficial in densely populated circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures suitability for a wide range of consumer applications, enhancing reliability in average conditions.

Technology: CMOS

CMOS technology offers lower power consumption and higher density, which is crucial for efficient memory storage.

Parallel or Serial: SERIAL

Serial communication simplifies interfacing with microcontrollers and reduces the number of required pins on the device.

Terminal Form: GULL WING

Gull wing terminals are common and widely compatible with standard PCBs, simplifying soldering and assembly.

Maximum Supply Current: 2 mA

A maximum supply current of 2 mA ensures low power consumption, ideal for battery-operated devices.

No. of Words: 256 words

With 256 words of memory, this EEPROM is capable of storing essential data for various applications.

Memory Width: 8

8-bit memory width allows for efficient data storage and retrieval, meeting typical application requirements.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years highlights the reliability of the memory, ensuring longevity of stored data.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for fine-pitch applications, essential for high-density layouts.

No. of Words Code: 256

Supports 256 words code, providing adequate flexibility for various data storage tasks.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V makes this EEPROM suitable for a variety of power conditions in electronic applications.

Endurance: 1,000,000 Write/Erase Cycles

An endurance of 1 million write/erase cycles ensures longevity and reliability for applications with frequent updates.

Serial Bus Type: I2C

Utilizing the I2C bus type simplifies communication protocols and is ideal for multiple device connections in embedded systems.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of just 10 ms enables efficient data management in applications requiring quick updates.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM provides ample storage for small data sets without compromising speed.

Memory IC Type: EEPROM

Being an EEPROM type IC, it supports non-volatile memory requirements, ideal for applications needing data retention without power.

Maximum Standby Current: 0.000001 Amp

A maximum standby current of only 1 µA showcases its energy-efficient design, perfect for battery-powered equipment.

Technical Specifications

EEPROM M34E02-FDW1TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FDW1TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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