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M34E02-FDW1TG

STMicroelectronics

M34E02-FDW1TG by STMicroelectronics

M34E02-FDW1TG by STMicroelectronics is a 2048-bit EEPROM with a compact SOIC package, operating at 2.5V and supporting I2C communication. It features a max clock frequency of 400 kHz, ensuring efficient data transfer. Ideal for consumer electronics, it offers robust write protection and high endurance of 1M cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,052 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,052

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Digiode

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,015

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Anansix

USA . 1,965 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,965

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,034 parts In-Stock

1+ parts

$2.531

100+ parts

-

1k+ parts

$2.278

10k+ parts

-

2,034

$2.531

-

$2.278

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MKK Technologies

India . 857 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

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857

$4.759

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DigiPath Technology Company

USA . 857 parts In-Stock

1+ parts

$4.759

100+ parts

-

1k+ parts

-

10k+ parts

-

857

$4.759

-

-

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Parana Technologies

USA . 820 parts In-Stock

1+ parts

-

100+ parts

$3.026

1k+ parts

-

10k+ parts

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820

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$3.026

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Corphita

USA . 501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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501

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Overview

Unlock endless possibilities with the M34E02-FDW1TG EEPROM from STMicroelectronics, a leader in semiconductor innovation. This compact, high-quality memory solution is designed for versatile applications that demand reliability and efficiency. With advanced write protection features and exceptional endurance, it ensures data integrity under various conditions. Experience peace of mind knowing you're backed by ST's commitment to excellence, making your projects smarter and more efficient!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction enhances reliability and protects against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape optimizes space utilization on PCBs for efficient layout.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures fast data transfer rates, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 2.5 V

Low nominal supply voltage reduces power consumption, ideal for battery-powered devices.

Power Supplies: 1.8/3.3 V

Versatile power supply range accommodates various device requirements and enhances compatibility.

No. of Terminals: 8

Compact 8-terminal design simplifies integration into tight-space applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile contribute to lightweight design, perfect for portable electronics.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures reliability in diverse environments and applications.

Organization: 256X8

Structured organization maximizes memory usage efficiency for optimal data storage.

Minimum Operating Temperature: 0 °C

Operational stability in lower temperatures expands the range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes enhance solderability and improve long-term reliability.

I2C Control Byte: 1010DDDR

Standardized I2C protocol simplifies communication and integration with various systems.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB design and assembly.

Write Protection: HARDWARE/SOFTWARE

Dual-level write protection ensures data integrity and security during operations.

Maximum Seated Height: 1.2 mm

Low profile minimizes overall height, making it suitable for space-constrained designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

Adequate clock frequency supports efficient data transfer in many embedded applications.

Width: 3 mm

Compact width allows for placement in tight spaces on circuit boards.

Minimum Supply Voltage (Vsup): 1.7 V

Lower supply voltage helps enhance device compatibility and prolongs battery life.

Length: 4.4 mm

Short length supports high-density layouts in modern electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade meets the needs of most consumer electronics and industrial applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies wiring in compact designs.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability and ease of mounting.

Maximum Supply Current: 2 mA

Low supply current extends battery life and reduces heat generation in applications.

No. of Words: 256 words

Adequate word count offers sufficient storage for a variety of applications.

Memory Width: 8

8-bit memory width is compatible with typical data bus architectures in embedded systems.

Minimum Data Retention Time: 40 years

Extended data retention period ensures information safety over long durations, ideal for critical applications.

Terminal Pitch: 0.65 mm

Standard terminal pitch facilitates easy mounting and compatibility with existing designs.

No. of Words Code: 256

Consistent word code promotes ease of use and integration in various systems.

Maximum Supply Voltage (Vsup): 3.6 V

Wide voltage tolerance supports a variety of power supply configurations.

Endurance: 1,000,000 Write/Erase Cycles

High endurance ensures reliability and durability in frequent write/erase scenarios.

Serial Bus Type: I2C

I2C bus compatibility facilitates easy integration into existing systems and simplifies circuitry.

Maximum Write Cycle Time (tWC): 10 ms

Quick write cycle time enhances overall system performance and responsiveness.

Memory Density: 2048 bit

Adequate memory density provides enough storage for many embedded applications.

Memory IC Type: EEPROM

EEPROM technology is ideal for applications requiring non-volatile memory, retaining data without power.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current optimizes power consumption, perfect for battery-operated devices.

Technical Specifications

EEPROM M34E02-FDW1TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FDW1TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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