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M34E02-FMB6G

STMicroelectronics

M34E02-FMB6G by STMicroelectronics

The STMicroelectronics M34E02-FMB6G is an EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. It operates in industrial temperature grades (-40 to 85 °C) and offers write protection via hardware/software. Ideal for applications requiring reliable non-volatile memory storage in compact form factors.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,491 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,491

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-

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Anansix

USA . 2,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,138

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Digiode

USA . 1,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,246

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$3.171

100+ parts

-

1k+ parts

$2.854

10k+ parts

-

188

$3.171

-

$2.854

-

MKK Technologies

India . 1,587 parts In-Stock

1+ parts

$5.963

100+ parts

-

1k+ parts

-

10k+ parts

-

1,587

$5.963

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-

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DigiPath Technology Company

USA . 1,587 parts In-Stock

1+ parts

$5.963

100+ parts

-

1k+ parts

-

10k+ parts

-

1,587

$5.963

-

-

-

Corphita

USA . 3,259 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,259

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Parana Technologies

USA . 588 parts In-Stock

1+ parts

-

100+ parts

$3.792

1k+ parts

-

10k+ parts

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588

-

$3.792

-

-

Overview

Unlock a world of endless possibilities with the M34E02-FMB6G by STMicroelectronics. This top-of-the-line EEPROM is crafted with precision and expertise, ensuring unparalleled quality and reliability. Ideal for a wide range of applications, this product offers seamless integration and exceptional performance. Experience the value and benefits of advanced technology with the M34E02-FMB6G, providing customers with peace of mind and innovative solutions for their electronic needs. Trust in STMicroelectronics to deliver cutting-edge products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and making the product suitable for compact designs.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages allows for flexibility in system design and compatibility with different setups.

No. of Terminals: 8

Having 8 terminals enables easy connectivity and integration with other components in the system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance even in demanding industrial environments.

Organization: 256X8

Organized in a 256x8 configuration, this EEPROM offers sufficient memory capacity and efficient data organization.

Write Protection: HARDWARE/SOFTWARE

The option for both hardware and software write protection enhances data security and prevents accidental overwriting or corruption.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this EEPROM can operate effectively in harsh temperature conditions.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM provides ample storage capacity for storing critical data.

Technical Specifications

EEPROM M34E02-FMB6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-N8

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FMB6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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