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CAT24C04C4ATR

Onsemi

CAT24C04C4ATR by Onsemi

CAT24C04C4ATR by Onsemi is a 4Kx1 EEPROM with 4096-bit memory density. It operates at 3.3V, has a max clock frequency of 0.4 MHz, and supports I2C serial bus type. Ideal for industrial applications requiring low power consumption and high endurance with up to 1,000,000 write/erase cycles.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 113 parts In-Stock

1+ parts

$0.220

100+ parts

$0.188

1k+ parts

$0.177

10k+ parts

-

113

$0.220

$0.188

$0.177

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Arrow

USA . 1,259 parts In-Stock

1+ parts

$0.223

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1,259

$0.223

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Rochester

USA . 380,822 parts In-Stock

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-

100+ parts

$0.134

1k+ parts

$0.111

10k+ parts

$0.099

380,822

-

$0.134

$0.111

$0.099

Chip1Stop

Japan . 4,955 parts In-Stock

1+ parts

-

100+ parts

$0.201

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$0.192

10k+ parts

$0.189

4,955

-

$0.201

$0.192

$0.189

Verical

USA . 1,259 parts In-Stock

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$0.223

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1,259

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$0.223

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Distributors (In-Stock)

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Digiode

USA . 2,120 parts In-Stock

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$0.104

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2,120

$0.104

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Nova Conductors

Japan . 150 parts In-Stock

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$0.399

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150

$0.399

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Vyrian

USA . 69,268 parts In-Stock

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69,268

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Chip Stock

USA . 67,500 parts In-Stock

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67,500

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NAC Semi

USA . 10,000 parts In-Stock

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$0.121

10,000

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$0.121

Prism Electronics

USA . 5,039 parts In-Stock

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5,039

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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J2 Sourcing AB

Sweden . 4,576 parts In-Stock

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4,576

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Netsource Technology, Inc.

USA . 3,554 parts In-Stock

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3,554

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Semtec, LLC

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 69,686 parts In-Stock

1+ parts

$0.093

100+ parts

-

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69,686

$0.093

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Corphita

USA . 2,333 parts In-Stock

1+ parts

$0.099

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2,333

$0.099

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Corohmni

South Africa . 459 parts In-Stock

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$0.188

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459

$0.188

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Continental Prestige Electronics

USA . 5,255 parts In-Stock

1+ parts

$0.399

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$0.391

5,255

$0.399

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$0.391

Argo Parts USA

USA . 2,173 parts In-Stock

1+ parts

$0.399

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$0.387

2,173

$0.399

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$0.387

Netroflash

USA . 100 parts In-Stock

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$0.399

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100

$0.399

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Aztec Data Supply Inc.

USA . 4,494 parts In-Stock

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$1.990

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$1.990

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Perfect Parts

USA . 17,935 parts In-Stock

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Lixinc

USA . 10,753 parts In-Stock

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SupplyDigital Components

Austria . 6,711 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,769 parts In-Stock

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TANS Electronics

Latvia . 4,313 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,179 parts In-Stock

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Problanco Electronics

Mexico . 957 parts In-Stock

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Infinite Electronics LLP (Excess)

. 503 parts In-Stock

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503

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UHIMA Technologies

Türkiye . 349 parts In-Stock

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349

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Formix International (Excess)

India . 272 parts In-Stock

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Kulean Microsystems

USA . 152 parts In-Stock

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Overview

Enhance your electronic devices with the reliable performance of the CAT24C04C4ATR EEPROM by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and innovation in every product they create. This EEPROM is perfect for a variety of applications, offering customers value through its durability, versatility, and efficiency. Upgrade your technology with the CAT24C04C4ATR and experience seamless operation like never before. Elevate your projects with Onsemi's trusted solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that helps protect the EEPROM chip from external elements and ensures longevity.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient data transfer and communication with other synchronous devices.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for stable performance and power efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating in high temperature environments, making it suitable for a wide range of applications.

Memory Density: 4096 bit

Offers a high memory density, allowing for storage of a large amount of data in a compact chip.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures reliability and longevity of the EEPROM chip, making it suitable for frequent read/write operations.

Technical Specifications

EEPROM CAT24C04C4ATR attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010000R

JESD-30 Code:

R-PBGA-B4

JESD-609 Code:

e1

Length:

.86 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

No. of Words:

4096 words

No. of Words Code:

4K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4KX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.38 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.84 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAT24C04C4ATR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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