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M34E02-FMB1TP

STMicroelectronics

M34E02-FMB1TP by STMicroelectronics

M34E02-FMB1TP by STMicroelectronics is a compact EEPROM with a 256x8 organization, operating at 2.5V and supporting I2C communication. It features a max clock frequency of 400 kHz and offers hardware/software write protection. Ideal for low-power applications, it ensures reliable data retention with up to 1M write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,853 parts In-Stock

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4,853

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Anansix

USA . 2,348 parts In-Stock

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2,348

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Digiode

USA . 394 parts In-Stock

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394

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$3.157

100+ parts

-

1k+ parts

$2.842

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616

$3.157

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$2.842

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MKK Technologies

India . 860 parts In-Stock

1+ parts

$5.937

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860

$5.937

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DigiPath Technology Company

USA . 860 parts In-Stock

1+ parts

$5.937

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860

$5.937

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Corphita

USA . 2,418 parts In-Stock

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2,418

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Parana Technologies

USA . 1,262 parts In-Stock

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$3.775

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1,262

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$3.775

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Overview

Unlock endless possibilities with the M34E02-FMB1TP EEPROM from STMicroelectronics, a leader in quality and innovation. This high-performance memory solution offers exceptional reliability for your projects, whether in consumer electronics, automotive systems, or industrial applications. Enjoy energy efficiency, versatile configurations, and robust data protection features that ensure your critical information is safe. Elevate your designs while benefiting from STMicroelectronics' renowned expertise and commitment to excellence!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic devices, saving space on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape is standard for many electronic applications, facilitating compatibility with various PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates, making the EEPROM suitable for high-speed applications.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage of 2.5 V enables low-power consumption, ideal for battery-operated devices.

Power Supplies (V): 1.8/3.3 V

Compatibility with multiple supply voltages increases flexibility in design, allowing use in diverse applications.

No. of Terminals: 8

Having 8 terminals provides adequate connections for interfacing and ensures stability in communication.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The small outline package style reduces footprint and weight, making it perfect for modern compact electronics.

Maximum Operating Temperature: 70 °C

A maximum temperature rating of 70 °C ensures reliability in various environmental conditions.

Organization: 256X8

The memory organization allows for efficient data storage and retrieval, optimizing application performance.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for use in a wide range of environments, increasing applicability.

I2C Control Byte: 1010DDDR

Using I2C control simplifies communication with microcontrollers, making integration easier for developers.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility and promotes better contact reliability.

Write Protection: HARDWARE/SOFTWARE

Dual write protection mechanisms increase data security, preventing accidental data loss or corruption.

Maximum Seated Height: 0.6 mm

A low seated height contributes to a flat PCB profile, which is crucial for low-profile device designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

Supports a reasonable clock frequency that balances speed and power consumption, ideal for a variety of applications.

Width: 2 mm

A compact width allows the product to fit into small spaces, catering to miniaturized electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

Operating at a minimum voltage of 1.7 V supports lower voltage systems, making it versatile for various applications.

Length: 3 mm

The short length further enables efficient use of space on printed circuit boards.

Temperature Grade: COMMERCIAL

Being commercially graded signifies reliability and performance in standard consumer environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Parallel or Serial: SERIAL

Serial communication dramatically reduces pin count, simplifying designs and reducing space requirements.

Terminal Form: NO LEAD

The no-lead form factor minimizes the risk of solder issues while promoting a cleaner design.

Maximum Supply Current: 2 mA

A maximum supply current of 2 mA contributes to power efficiency, an essential feature for portable devices.

No. of Words: 256 words

A capacity of 256 words provides sufficient memory for basic applications and configurations.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and is standard in many embedded applications.

Minimum Data Retention Time: 40 years

Long data retention time of 40 years ensures reliable long-term storage, minimizing data management concerns.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch promotes compatibility with modern SMT practices, ensuring easier manufacturing.

No. of Words Code: 256

The code reinforces the product's storage capability, confirming sufficient space for necessary configurations.

Maximum Supply Voltage (Vsup): 3.6 V

Operating up to 3.6 V accommodates a broad range of applications, making it highly versatile.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating ensures durability and reliability in frequent write/erase operations, suitable for dynamic data.

Serial Bus Type: I2C

I2C bus type compatibility simplifies communication with multiple devices on a single bus, reducing complexity.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time enhances overall performance, reducing delays in applications that require quick data updates.

Memory Density: 2048 bits

The memory density of 2048 bits allows for efficient storage of configuration and setting data in compact sizes.

Memory IC Type: EEPROM

Being an EEPROM type enables non-volatile storage, ensuring data persistence even during power loss.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current means minimal power consumption during idle states, perfect for battery-powered applications.

Technical Specifications

EEPROM M34E02-FMB1TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-XDSO-N8

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M34E02-FMB1TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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