Loading...

M29F010B45K1

STMicroelectronics

M29F010B45K1 by STMicroelectronics

M29F010B45K1 from STMicroelectronics is a 1Mb NOR Flash memory with a 5V supply, featuring an asynchronous operating mode and a max access time of 45 ns. It supports up to 100,000 write/erase cycles and operates in commercial temperature ranges. Ideal for embedded applications, it comes in a compact chip carrier package with 32 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,843

-

-

-

-

Digiode

USA . 2,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,606

-

-

-

-

Anansix

USA . 1,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,375

-

-

-

-

LIBRA Elektronik GmbH

Germany . 44 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

44

-

-

-

-

J2 Sourcing AB

Sweden . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

Prism Electronics

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

J & M Industries LLC

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$4.583

100+ parts

-

1k+ parts

$4.125

10k+ parts

-

1,476

$4.583

-

$4.125

-

Microchip USA

USA . 395 parts In-Stock

1+ parts

$7.929

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$7.929

-

-

-

MKK Technologies

India . 864 parts In-Stock

1+ parts

$8.619

100+ parts

-

1k+ parts

-

10k+ parts

-

864

$8.619

-

-

-

DigiPath Technology Company

USA . 864 parts In-Stock

1+ parts

$8.619

100+ parts

-

1k+ parts

-

10k+ parts

-

864

$8.619

-

-

-

AZTECH Wire

Italy . 653 parts In-Stock

1+ parts

$20.640

100+ parts

-

1k+ parts

-

10k+ parts

-

653

$20.640

-

-

-

A-Z Elektronik GmbH

Germany . 5,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,838

-

-

-

-

Alle Elektronik GmbH

Germany . 3,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,892

-

-

-

-

Corphita

USA . 637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

637

-

-

-

-

Parana Technologies

USA . 56 parts In-Stock

1+ parts

-

100+ parts

$5.480

1k+ parts

-

10k+ parts

-

56

-

$5.480

-

-

Perfect Parts

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Unlock the power of innovation with the M29F010B45K1 Flash Memory from STMicroelectronics! Renowned for its exceptional quality and reliability, this versatile device is perfect for a range of applications, from consumer electronics to industrial systems. With a fast access time and robust endurance, it ensures seamless performance and longevity. Trust in STMicroelectronics’ expertise to enhance your designs and drive success, delivering unmatched value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability of the flash memory.

Surface Mount: YES

Enables compact design and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

Optimized design for efficient space utilization on PCBs.

Operating Mode: ASYNCHRONOUS

Provides quicker data access times, improving system performance.

Nominal Supply Voltage / Vsup: 5V

Standard voltage requirements make it compatible with a wide range of applications.

Power Supplies (V): 5

Consistent power supply allows for stable operation across various environments.

No. of Terminals: 32

Sufficient terminals facilitate robust connections and support versatile designs.

Package Style (Meter): CHIP CARRIER

Compact form factor enhances mountability in restricted spaces.

Maximum Operating Temperature: 70 °C

High temperature tolerance ensures reliable performance in elevated thermal conditions.

Organization: 128KX8

Flexible organization allows for efficient data storage and retrieval strategies.

Minimum Operating Temperature: 0 °C

Suitable for a variety of applications without concern for low temperature impacts.

No. of Sectors/Size: 8

Multiple sectors improve data management and organization for users.

Terminal Finish: TIN LEAD

Reliable finish enhances solderability and connection integrity.

Terminal Position: QUAD

Quad terminal layout allows for efficient layout and electrical performance.

Maximum Seated Height: 3.56 mm

Low profile design ensures compatibility with slim electronic devices.

Width: 11.43 mm

Narrow width contributes to space-saving designs in compact electronics.

Minimum Supply Voltage (Vsup): 4.5V

Lower supply voltage requirement increases design flexibility in power-sensitive applications.

Type: NOR TYPE

NOR technology allows for fast random access, ideal for code storage applications.

Length: 13.97 mm

Compact length enhances integration into tight spaces within electronic assemblies.

Programming Voltage (V): 5

Standard programming voltage simplifies design and usage in embedded systems.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliability for general commercial applications.

Technology: CMOS

CMOS technology offers low power consumption, enhancing operational efficiency.

Parallel or Serial: PARALLEL

Parallel access speeds up data operations, making it suitable for high-speed applications.

Terminal Form: J BEND

J bend terminations provide reliable mechanical support during soldering.

Sector Size (Words): 16K

Ample sector size enhances data management and access efficiency.

Maximum Supply Current: 20 mA

Low current consumption is beneficial for battery-operated devices.

No. of Words: 131072 words

Large word count supports substantial data storage capacity.

Toggle Bit: YES

Toggle bit functionality simplifies the interface for users, enhancing data reliability.

Memory Width: 8

8-bit width makes it compatible with standard data buses for easy integration.

Terminal Pitch: 1.27 mm

Standard pitch for terminals facilitates connections with typical PCB layouts.

No. of Words Code: 128K

Good capacity for applications requiring significant storage without excessive complexity.

Command User Interface: YES

User-friendly command interface allows for easier programming and control.

Maximum Supply Voltage (Vsup): 5.5V

Tolerance for higher supply voltages adds flexibility to design requirements.

Endurance: 100000 Write/Erase Cycles

High endurance ensures durability and reliability over extended usage cycles.

Memory Density: 1048576 bit

High-density memory enhances storage capability in compact form factors.

Memory IC Type: FLASH

Flash memory type supports non-volatile storage, suitable for long-term data retention.

Maximum Standby Current: 0.0001 Amp

Minimal standby current reduces energy consumption, ideal for energy-efficient designs.

Maximum Access Time: 45 ns

Fast access time contributes to high-speed data processing requirements.

Data Polling: YES

Data polling feature allows for real-time status checking during programming, enhancing reliability.

Technical Specifications

Flash Memory M29F010B45K1 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

16K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M29F010B45K1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20