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M28W160B120GJ6

STMicroelectronics

M28W160B120GJ6 by STMicroelectronics

M28W160B120GJ6 from STMicroelectronics is a 16-bit NOR Flash memory with a density of 16Mbit, ideal for industrial applications. It operates b/w -40 °C to 85 °C and features a max access time of 120 ns. This surface-mount device supports parallel interface and offers reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,280 parts In-Stock

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4,280

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Vyrian

USA . 3,711 parts In-Stock

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3,711

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Anansix

USA . 1,442 parts In-Stock

1+ parts

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1,442

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,671 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

$4.761

10k+ parts

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1,671

$5.290

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$4.761

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MKK Technologies

India . 767 parts In-Stock

1+ parts

$9.948

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767

$9.948

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DigiPath Technology Company

USA . 767 parts In-Stock

1+ parts

$9.948

100+ parts

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767

$9.948

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Corphita

USA . 335 parts In-Stock

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335

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Parana Technologies

USA . 161 parts In-Stock

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$6.325

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161

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$6.325

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Overview

Unlock the potential of your designs with the M28W160B120GJ6 Flash Memory from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers a robust solution perfect for industrial applications where reliability is crucial. With temperatures ranging from -40 °C to 85 °C, this NOR type memory ensures performance even in demanding environments. Experience faster access times and enhanced efficiency that drive your projects forward, making it the ideal choice for advanced technology solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability, ensuring reliability in various environmental conditions.

Surface Mount: YES

Surface mount capability allows for a compact design, which enables use in space-constrained applications.

Package Shape: RECTANGULAR

Rectangular packaging optimizes board space and simplifies layout in electronic designs.

Power Supplies (V): 1.65/2.2,3

Wide voltage supply range enhances compatibility with various systems, improving versatility.

No. of Terminals: 46

A higher number of terminals can facilitate better connections and performance in complex applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch enables higher density mounting, contributing to compact circuit designs.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in demanding conditions, ideal for industrial applications.

Organization: 1MX16

1Mx16 organization optimizes data handling efficiency, suitable for various applications.

Minimum Operating Temperature: -40 °C

Low temperature operation extends the product's usability in extreme environments.

No. of Sectors/Size: 8,31

Multiple sectors enhance flexibility in data management and storage, making it adaptable for various tasks.

Terminal Finish: TIN LEAD

Tin lead finish offers good solderability and reliability during assembly, reducing failure rates.

Terminal Position: BOTTOM

Bottom terminal positioning can aid in minimizing space taken on the PCB while ensuring effective signal integrity.

Type: NOR TYPE

NOR type flash memory allows for fast read speeds and random access, making it suitable for applications needing quick data retrieval.

Common Flash Interface: YES

Compatibility with the common flash interface simplifies integration into existing systems and reduces design time.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability in harsh environments, enhancing product longevity.

Technology: CMOS

CMOS technology supports low power consumption while providing robust performance, making it energy-efficient.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, making it ideal for high-speed applications.

Terminal Form: BALL

Ball terminal form aids in reliable solder connections and improved thermal and electrical performance.

Sector Size (Words): 4K,32K

Flexible sector sizes permit optimized memory allocation tailored to specific application needs.

Maximum Supply Current: 20 mA

Low maximum supply current contributes to overall power efficiency, making it suitable for battery-powered devices.

No. of Words: 1048576 words

A significant word count allows for substantial data storage, fitting for demanding applications.

Memory Width: 16

16-bit memory width supports efficient data handling and processing capabilities for a variety of tasks.

Terminal Pitch: 0.75 mm

Smaller terminal pitch enables high-density packing, which is ideal for advanced electronic applications.

No. of Words Code: 1M

1M words coding ensures ample space for application requirements, allowing it to cater to complex projects.

Command User Interface: YES

User-friendly command interface simplifies communication and control, enabling ease of integration.

Boot Block: BOTTOM

A bottom boot block enhances reliability and security during firmware updates, protecting critical data.

Memory Density: 16777216 bit

High memory density allows for storing large amounts of data, which is beneficial for data-intensive applications.

Memory IC Type: FLASH

Flash memory type ensures data retention without power, suitable for various applications including firmware storage.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current enhances energy efficiency, crucial for portable and battery-operated devices.

Maximum Access Time: 120 ns

Fast access time at 120 ns ensures quick data retrieval, making it ideal for high-performance applications.

Technical Specifications

Flash Memory M28W160B120GJ6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B46

JESD-609 Code:

e0

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

No. of Sectors/Size:

8,31

No. of Terminals:

46

No. of Words:

1048576 words

No. of Words Code:

1M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA46,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.65/2.2,3

Qualification:

Not Qualified

Sector Size (Words):

4K,32K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Trade Compliance

M28W160B120GJ6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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