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LRI64-W4/3XX

STMicroelectronics

LRI64-W4/3XX by STMicroelectronics

LRI64-W4/3XX by STMicroelectronics is a 64-bit memory circuit with CMOS technology. It operates asynchronously, has an organization of 64X1, and supports a supply voltage range from 1.5V to 3V. This unencased chip is suitable for applications requiring surface mount memory ICs in temperature ranges from -20 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,426 parts In-Stock

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Digiode

USA . 3,119 parts In-Stock

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3,119

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Anansix

USA . 300 parts In-Stock

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300

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,956 parts In-Stock

1+ parts

$2.387

100+ parts

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$2.149

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$2.387

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$2.149

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MKK Technologies

India . 393 parts In-Stock

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$4.489

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393

$4.489

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DigiPath Technology Company

USA . 393 parts In-Stock

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$4.489

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393

$4.489

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Corphita

USA . 1,639 parts In-Stock

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Parana Technologies

USA . 868 parts In-Stock

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$2.854

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868

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$2.854

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Overview

Unlock the power of cutting-edge technology with the LRI64-W4/3XX by STMicroelectronics. Designed to deliver unmatched quality and reliability, this memory circuit IC is perfect for a wide range of applications. With a temperature range of -20 °C to 85°C, this product offers superior performance under any conditions. Trust STMicroelectronics, a leading manufacturer in the industry, to provide you with a top-notch solution that will exceed your expectations. Upgrade your systems today and experience the benefits of seamless operation and unmatched efficiency with the LRI64-W4/3XX.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Enables independent operation without the need for synchronization, providing flexibility in data processing.

Package Style (Meter): UNCASED CHIP

Compact and lightweight design ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Organization: 64X1

Offers a high memory density with 64 bits of data storage.

Minimum Operating Temperature: -20 °C

Can withstand low temperatures, making it suitable for a wide range of operating conditions.

Terminal Position: UPPER

Facilitates easy connectivity and integration into existing circuitry.

Minimum Supply Voltage (Vsup): 1.5 V

Operates efficiently at low voltage levels, reducing power consumption.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed performance.

Terminal Form: NO LEAD

Eliminates the need for external leads, simplifying installation and reducing the risk of connection errors.

No. of Words: 64 words

Provides ample storage capacity for data processing and retrieval.

Maximum Supply Voltage (Vsup): 3 V

Supports a wide voltage range for compatibility with different power sources.

Memory Density: 64 bit

Offers a high density of memory storage in a compact form factor.

Memory IC Type: MEMORY CIRCUIT

Specifically designed for memory circuit applications, ensuring optimized performance and reliability.

Technical Specifications

Other Function Memory ICs LRI64-W4/3XX attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

64 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

64X1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LRI64-W4/3XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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