Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LRI64-SBN18/3XX by STMicroelectronics is a 64-bit memory circuit with CMOS technology. It operates asynchronously, has an organization of 64X1, and supports a supply voltage range from 1.5V to 3V. This surface-mount IC in unencased chip package style is ideal for applications requiring high-speed memory access and low power consumption.
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$7.551
DigiPath Technology Company
Corphita
Parana Technologies
$4.802
Surface mount technology makes this product easy to install on circuit boards, allowing for efficient production processes.
Asynchronous operation allows for flexibility in timing and can be beneficial in various applications where synchronization is not critical.
Uncased chip package style helps in reducing overall product size and weight, making it suitable for compact electronic devices.
With a high maximum operating temperature, this product can withstand heat and perform reliably in challenging environments.
The 64X1 organization provides a good balance between memory capacity and access speed, suitable for many memory applications.
A low minimum operating temperature ensures that this product can function in cold conditions without any issues.
Upper terminal position makes it easier to connect this product within a circuit system, improving overall usability and accessibility.
Low minimum supply voltage requirements make this product energy-efficient and suitable for battery-operated devices.
CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient in various applications.
No lead terminal form simplifies the installation process and ensures a secure connection, enhancing the overall reliability of this product.
With 64 words of memory density, this product offers sufficient storage capacity for data processing and storage requirements.
A high maximum supply voltage tolerance provides flexibility in power supply options, accommodating various voltage levels in different systems.
The 64-bit memory density enables efficient data storage and retrieval, meeting the needs of memory-intensive applications.
As a memory circuit IC, this product is designed specifically for handling memory-related functions, ensuring optimal performance in memory applications.
Other Function Memory ICs LRI64-SBN18/3XX attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
LRI64-SBN18/3XX Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
M39029/58-360
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
Vishay Sprague
M24308/2-1F
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
Surge Components
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
TMS4C1060-60SD
Texas Instruments
TMS4C1060-60SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
DS2502X1
Dallas Semiconductor
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Code: FBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TMS27PC32-120JE4
Other Memory ICs;
DS2502R+U
Other Memory ICs; Peak Reflow Temperature (C): 260; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;
TMS27PC32JL
SN7489N
SN7489N by Texas Instruments is a 16x4 memory circuit IC with CMOS technology. It operates asynchronously at 5V, with open-collector output characteristics and a max access time of 60ns. This IC is commonly used in applications requiring parallel memory storage and retrieval.
AT88SC0104CA-Y6H-T
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Write Protection: SOFTWARE;
SN74ACT2151-25N
SN74ACT2151-25N by Texas Instruments is a 1KX12 MEMORY CIRCUIT IC with 25 ns access time, suitable for COMMERCIAL applications. It operates at 5V, has 28 terminals in IN-LINE package style, and offers a memory density of 12288 bits. Ideal for various electronic devices requiring fast memory access within the temperature range of 0 to 70°C.
MR2A16AVYS35
NXP Semiconductors
The NXP Semiconductors MR2A16AVYS35 is a 256Kx16 memory IC with CMOS technology. It operates asynchronously at temperatures ranging from -40 to 105°C, with a supply voltage of 3-3.6V. This small outline, thin profile package is ideal for industrial applications requiring high memory density and reliability.
SN74AS871DW
SN74AS871DW by Texas Instruments is a TTL technology IC with 28 terminals in a small outline package. Operating temperature range is 0-70°C, suitable for commercial applications. It features gull wing terminals and is surface mountable, ideal for various memory functions.
DS2401AZ+T&R
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
DS2401P+T&R
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Form: C BEND;
M36W216BI85ZA6T
M36W216BI85ZA6T from STMicroelectronics is a low-profile, asynchronous mixed memory IC featuring 16Mbit density with Flash+SRAM technology. It operates b/w -40 °C to 85 °C and supports a supply voltage of 2.7V to 3.3V. Ideal for industrial applications requiring compact memory solutions.
AT88SC018-SU-CN
Microchip Technology
AT88SC018-SU-CN by Microchip Technology is a 4Kx1 memory circuit IC with 4096-bit memory density. It operates in synchronous mode, has a small outline package style, and supports a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring secure data storage in compact electronic devices.
7230
Intel
Intel 7230 is a CMOS memory circuit with 22 terminals in an in-line rectangular package. It has a max seated height of 5.08mm, width of 10.16mm, and length of 27.3685mm. Ideal for applications requiring compact memory ICs with through-hole terminals.
TMS4C1050-60DJ
TMS4C1050-60DJ by Texas Instruments is a 20-terminal memory IC with 5V supply, operating b/w 0-70°C. It features a max access time of 60ns and standby current of 0.01A, suitable for commercial applications requiring fast memory circuits in small outline packages.
DS1207-G02
DS1207-G02 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals, operating SYNCHRONOUSLY at temperatures from 0 °C to 70°C. Its RECTANGULAR package shape and TIN LEAD terminal finish make it ideal for COMMERCIAL applications.
ADSP8210JG
Other Memory ICs; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; Technology: ECL; Minimum Operating Temperature: 0 Cel;
DS6417P-001
DS6417P-001 by Analog Devices is a 128Kx8 MEMORY CIRCUIT with CMOS tech. Operating at 0-70 °C, it has a supply voltage range of 4.5-5.5V. Ideal for applications requiring MICROELECTRONIC ASSEMBLY in COMMERCIAL settings.
ST25DV16K-IER6T3
ST25DV16K-IER6T3 by STMicroelectronics is a 16KX1 MEMORY CIRCUIT with 16384 bit Memory Density. It operates at 3.3V, -40 to 85 °C temperature range, in SYNCHRONOUS mode. Ideal for industrial applications requiring small outline, thin profile ICs with shrink pitch package style.
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LRI64-W4/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Terminal Form: NO LEAD;
LRI64-W4/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Operating Temperature: 85 Cel;
LRI64-W4/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words: 64 words; No. of Functions: 1;
LRI64-MBTG/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LRI64-SBN18/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; No. of Words Code: 64;
LRI64-MBTG/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Length: 3 mm;
LRI64-SBN18/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 1; Memory Density: 64 bit;
LRI64-MBTG/1XX
LRI64-SBN18/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Memory Width: 1;
LRI64-SBN18/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Supply Voltage (Vsup): 1.5 V;
LRI64-W4/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Supply Voltage (Vsup): 1.5 V; Minimum Operating Temperature: -20 Cel;
LRI64-MBTG/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Surface Mount: YES;
LRI64-MBTG/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 64 words;
LRI64-MBTG/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
LRI64-SBN18/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Maximum Supply Voltage (Vsup): 3 V;
LRI64-W4/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1; Operating Mode: ASYNCHRONOUS;
LRI64-W4/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Minimum Supply Voltage (Vsup): 1.5 V;
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