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LRI64-W4/3GE

STMicroelectronics

LRI64-W4/3GE by STMicroelectronics

LRI64-W4/3GE by STMicroelectronics is a 64-bit memory circuit with asynchronous operation, CMOS technology, and 64x1 organization. It operates b/w -20 °C to 85°C, with supply voltage range of 1.5V to 3V. This surface-mount IC is ideal for applications requiring compact uncased chip memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,210 parts In-Stock

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4,210

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Vyrian

USA . 3,972 parts In-Stock

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3,972

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Anansix

USA . 827 parts In-Stock

1+ parts

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827

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,101 parts In-Stock

1+ parts

$4.518

100+ parts

-

1k+ parts

$4.066

10k+ parts

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2,101

$4.518

-

$4.066

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MKK Technologies

India . 475 parts In-Stock

1+ parts

$8.496

100+ parts

-

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475

$8.496

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DigiPath Technology Company

USA . 475 parts In-Stock

1+ parts

$8.496

100+ parts

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475

$8.496

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Corphita

USA . 689 parts In-Stock

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689

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Parana Technologies

USA . 496 parts In-Stock

1+ parts

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$5.402

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496

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$5.402

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Overview

Unlock the power of reliable and efficient memory solutions with the STMicroelectronics LRI64-W4/3GE. Manufactured by industry leader STMicroelectronics, this quality product offers unmatched performance and versatility for a wide range of applications. From consumer electronics to industrial automation, this memory IC is designed to meet your needs with its surface mount design, asynchronous operating mode, and wide temperature range. Trust in STMicroelectronics to deliver cutting-edge technology that enhances your products and provides lasting value.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and enabling efficient production processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility and allows for independent functioning without strict timing requirements.

Package Style (Meter): UNCASED CHIP

Uncased chip packaging offers cost-efficient and compact design for easy handling and mounting.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Organization: 64X1

64X1 organization allows for efficient storage and retrieval of data in a streamlined manner.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures functionality even in colder environments.

Terminal Position: UPPER

Upper terminal position facilitates easy connections and compatibility with standard board layouts.

Minimum Supply Voltage (Vsup): 1.5 V

Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various applications.

Terminal Form: NO LEAD

No lead terminal form simplifies assembly and reduces the risk of damage during installation.

No. of Words: 64 words

64-word memory capacity allows for storing and retrieving a sufficient amount of data for multiple applications.

No. of Words Code: 64

Consistent 64-word code simplifies programming and integration into existing systems.

Maximum Supply Voltage (Vsup): 3 V

Safe maximum supply voltage allows for reliable operation without the risk of damage to the memory circuit.

Memory Density: 64 bit

64-bit memory density provides ample storage capacity for various data storage needs.

Memory IC Type: MEMORY CIRCUIT

Dedicated memory circuit type ensures efficient and reliable data storage and retrieval capabilities.

Technical Specifications

Other Function Memory ICs LRI64-W4/3GE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

64 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

64X1

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

3 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LRI64-W4/3GE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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