Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
LRI64-W4/3GE by STMicroelectronics is a 64-bit memory circuit with asynchronous operation, CMOS technology, and 64x1 organization. It operates b/w -20 °C to 85°C, with supply voltage range of 1.5V to 3V. This surface-mount IC is ideal for applications requiring compact uncased chip memory solutions.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Anansix
IDEA Electronic Components Group
$4.518
$4.066
MKK Technologies
$8.496
DigiPath Technology Company
Corphita
Parana Technologies
$5.402
Surface mount capability allows for easy integration onto circuit boards, saving space and enabling efficient production processes.
Asynchronous operation provides flexibility and allows for independent functioning without strict timing requirements.
Uncased chip packaging offers cost-efficient and compact design for easy handling and mounting.
High maximum operating temperature ensures reliable performance in various environmental conditions.
64X1 organization allows for efficient storage and retrieval of data in a streamlined manner.
Low minimum operating temperature ensures functionality even in colder environments.
Upper terminal position facilitates easy connections and compatibility with standard board layouts.
Low minimum supply voltage ensures energy efficiency and compatibility with a wide range of systems.
CMOS technology offers low power consumption, high noise immunity, and compatibility with various applications.
No lead terminal form simplifies assembly and reduces the risk of damage during installation.
64-word memory capacity allows for storing and retrieving a sufficient amount of data for multiple applications.
Consistent 64-word code simplifies programming and integration into existing systems.
Safe maximum supply voltage allows for reliable operation without the risk of damage to the memory circuit.
64-bit memory density provides ample storage capacity for various data storage needs.
Dedicated memory circuit type ensures efficient and reliable data storage and retrieval capabilities.
Other Function Memory ICs LRI64-W4/3GE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
LRI64-W4/3GE Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Bytesonic Electronics
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
LL4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
Secos
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
M36W216T100ZA1
STMicroelectronics
M36W216T100ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal supply and operates b/w 2.7V to 3.3V. It features a density of 16Mbit, organized as 1Mx16, and supports commercial temp ranges up to 70 °C. Ideal for compact applications requiring efficient data storage in embedded systems.
LC331632M-10
LC331632M-10 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output. It operates at a nominal voltage of 5V and has a memory density of 524288 bits. This small outline package is ideal for applications requiring common I/O type in commercial temperature grades.
TMS4C1070-40N
TMS4C1070-40N by Texas Instruments is a CMOS MEMORY CIRCUIT with 18 terminals, operating at 5V. It has a max access time of 30ns and standby current of 0.01Amp. This IC is used in applications requiring memory storage and operates within a temperature range of 0 to 70°C.
47L16T-E/ST
Microchip Technology
47L16T-E/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, operating in synchronous mode. It has an organization of 2KX8 and a memory density of 16384 bit. Ideal for automotive applications, it offers a wide temperature range from -40 to 125 °C and operates at supply voltages b/w 2.7V to 3.6V.
M38510/31901BEX
M38510/31901BEX by Texas Instruments is a MILITARY-grade MEMORY CIRCUIT with 16-bit memory density. It operates ASYNCHRONOUSLY at temperatures ranging from -55 to 125 °C, ideal for applications requiring reliable performance in harsh environments. The IC features a 4x4 organization and comes in a CERAMIC, METAL-SEALED COFIRED package with 16 terminals.
CY8C20110-LDX2I
CY8C20110-LDX2I by Infineon Technologies is a 2KX1 MEMORY CIRCUIT IC with SYNCHRONOUS operation, suitable for INDUSTRIAL applications. It operates at 3V with a temperature range of -40 to 85 °C and features a SQUARE package style measuring 3x3 mm in size. This NO LEAD chip carrier has 16 terminals on a 0.5mm pitch, making it ideal for compact electronic designs.
MPC5605BF0ACMG6
Analog Devices
MEMORY CIRCUIT;
SN74170JP4
SN74170JP4 by Texas Instruments is a TTL memory IC with 16 terminals, operating at 5V. It has a rectangular ceramic package and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring reliable memory functions in electronic circuits.
N36RW02DWPT3G
N36RW02DWPT3G by Onsemi is a memory circuit IC with 2048-bit density and 64x32 organization. It operates b/w -40 °C to 105°C, suitable for industrial applications. With a small outline package style, Gull Wing terminal form, and dual position terminals, it's ideal for compact electronic devices.
TMS27C32-120NL
Other Memory ICs;
DS1994L-F5-W
MR2A16AVMA35
Everspin Technologies
MR2A16AVMA35 by Everspin Technologies is a 256Kx16 memory IC with 35ns access time, operating at 3.3V. It features a low profile grid array package suitable for industrial applications requiring fast asynchronous operation and high memory density.
M30082040054X0IWAY
Renesas Electronics
Renesas Electronics M30082040054X0IWAY is a 1MX8 MEMORY CIRCUIT IC with 8388608 bit memory density. It operates synchronously at 3V, in a small outline package suitable for surface mounting. With an operating temperature range of -40 to 85 °C, it's ideal for applications requiring high-speed synchronous memory functions.
ST25DV04K-IER6S3
ST25DV04K-IER6S3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. This small outline IC has a rectangular shape, Gull Wing terminals, and can withstand temperatures from -40 to 85°C.
DS1996L-F5
Dallas Semiconductor
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Terminal Form: NO LEAD; Qualification: Not Qualified;
TMS27C256-45
DS2401P+T&R
Analog Devices' DS2401P+T&R is a 64-bit MEMORY CIRCUIT with 6 terminals, operating at 5V. It features ASYNCHRONOUS mode, CMOS technology, and industrial temperature grade. The IC is used in applications requiring small outline packages for memory storage in devices like sensors or IoT modules.
TMS27C49-4NTL
DS1653
DS1653 by Analog Devices is a CMOS MEMORY CIRCUIT with 16 terminals, operating at 0-70 °C. It has a supply voltage of 5V and comes in PLASTIC/EPOXY package. Ideal for applications requiring reliable memory storage in commercial-grade environments.
TMS2150-9JL
TMS2150-9JL by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 90ns access time, 145mA max supply current, and operates at 5V. It is used in applications requiring fast memory access and low power consumption in commercial-grade environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LRI64-W4/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Terminal Form: NO LEAD;
LRI64-W4/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Operating Temperature: 85 Cel;
LRI64-SBN18/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; No. of Functions: 1;
LRI64-MBTG/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LRI64-SBN18/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; No. of Words Code: 64;
LRI64-MBTG/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Length: 3 mm;
LRI64-SBN18/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 1; Memory Density: 64 bit;
LRI64-MBTG/1XX
LRI64-SBN18/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Memory Width: 1;
LRI64-SBN18/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Supply Voltage (Vsup): 1.5 V;
LRI64-W4/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Supply Voltage (Vsup): 1.5 V; Minimum Operating Temperature: -20 Cel;
LRI64-MBTG/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Surface Mount: YES;
LRI64-MBTG/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 64 words;
LRI64-MBTG/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
LRI64-SBN18/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Maximum Supply Voltage (Vsup): 3 V;
LRI64-W4/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1; Operating Mode: ASYNCHRONOUS;
LRI64-W4/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Minimum Supply Voltage (Vsup): 1.5 V;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved