Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STMicroelectronics LRI64-W4/2GE is a 64-bit memory circuit IC with CMOS technology. It operates asynchronously in a temperature range of -20 to 85 °C. Suitable for surface mount applications, it has an organization of 64X1 and requires a supply voltage b/w 1.5V to 3V.
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This feature allows for easy and efficient installation onto a PCB, making it a convenient choice for circuit board designs.
Asynchronous operation allows for independent clocking of data signals, providing flexibility and adaptability in different system configurations.
The unencased chip package style helps reduce space and weight, making it suitable for compact and lightweight electronic devices.
With a high maximum operating temperature, this memory IC can withstand elevated environmental conditions without performance degradation.
The 64X1 organization allows for efficient memory storage and retrieval operations in small increments, enhancing data processing capabilities.
The low minimum operating temperature ensures reliable performance even in cold environments, making it suitable for a wide range of applications.
The upper terminal position simplifies connectivity and integration with other components, facilitating system design and assembly.
With a low minimum supply voltage, this memory IC can operate efficiently with minimal power consumption, contributing to energy efficiency.
CMOS technology offers low power consumption and high noise immunity, making this memory IC ideal for battery-operated devices and noise-sensitive applications.
The no-lead terminal form simplifies soldering and eliminates the risk of lead contamination, ensuring environmental friendliness and manufacturing safety.
With 64 words of memory density, this memory circuit provides sufficient storage capacity for various data processing tasks and applications.
The high maximum supply voltage allows for compatibility with a wide range of power sources and system configurations, enhancing versatility.
The 64-bit memory density offers ample storage capacity for storing and managing data efficiently, making it suitable for memory-intensive applications.
As a memory circuit IC, this product is specifically designed for data storage and retrieval functions, making it a reliable choice for memory-related applications.
Other Function Memory ICs LRI64-W4/2GE attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
LRI64-W4/2GE Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semitron
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
New Jersey Semiconductor Products
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
Space Power Electronics
Itt Semiconductor
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
National Semiconductor
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
TMS27PC32-2JL
Other Memory ICs;
AT88SC25616C-MJ
Microchip Technology
AT88SC25616C-MJ by Microchip Technology is a 32KX8 CMOS CRYPTO MEMORY IC with 262144 bit memory density. It operates in SYNCHRONOUS mode with a max access time of 35 ns. Ideal for secure applications requiring fast data processing at temperatures b/w 0-70°C.
TMS27PC32-12JL4
DS28C50Q+T
Analog Devices
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; Peak Reflow Temperature (C): 260;
MTFDDAK1T9QDE-2AV1ZABYY
Micron Technology
MEMORY CIRCUIT;
FM33256B-GTR
Ramtron International
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
DS2411P/TR
Dallas Semiconductor
DS2411P/TR by Dallas Semiconductor is a 64-bit MEMORY CIRCUIT with 6 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.5-5.25V and consumes 0.1mA max current in a SMALL OUTLINE package suitable for industrial applications.
TMS2758-JL1
TMS2758-JL1 by Texas Instruments is a 1Kx8 MOS memory IC with 8192-bit density. It features 450ns access time, operates b/w 0-70°C, and has 3-state output characteristics. Ideal for applications requiring common I/O type in commercial-grade temperature environments.
FM3808-70-T
FM3808-70-T by Ramtron Int. is a 32KX8 MEMORY CIRCUIT IC with 262144 bit MEMORY DENSITY. Operating at SYNCHRONOUS mode, it has a supply voltage range of 4.5V to 5.5V and temp range of -40°C to 85°C. Ideal for industrial applications requiring high memory density in compact form factor.
MT29C8G96MAZBADKD-5WT
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
TMS4C1050-4N
TMS4C1050-4N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 30ns access time, and 70°C max temp. It is used in commercial-grade applications requiring reliable memory storage and operates on CMOS technology.
TMS2564-50JDL
TMS2564-50JDL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 500 ns access time. It features a MOS technology, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial temperature environments.
TMS27PC32-150JE4
TMS4C1070-30SD
TMS4C1070-30SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 25ns access time, and 70°C max temp. It is used in commercial applications requiring CMOS technology for memory functions.
M36W0R6030B0ZAQF
STMicroelectronics
M36W0R6030B0ZAQF by STMicroelectronics is a versatile memory IC featuring 4M x 16 organization, operating at a nominal voltage of 1.8V. It supports asynchronous access with a max temp of 85 °C, ideal for industrial applications. Its compact design ensures efficient space utilization in devices.
TMS27C49-45TL
DS1996L-F5+
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
M36W108T100ZN5T
M36W108T100ZN5T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature range of -20 °C to 85°C. This rectangular GRID ARRAY package is suitable for various applications requiring high-density memory solutions.
SN74HC670JP4
SN74HC670JP4 by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, suitable for industrial applications. With power supplies ranging from 2V to 6V, it offers reliable performance in various electronic devices.
CY15B102Q-SXE
Infineon Technologies
CY15B102Q-SXE by Infineon Technologies is a 256KX8 MEMORY CIRCUIT with SYNCHRONOUS operation and 3.3V nominal voltage. Ideal for AUTOMOTIVE applications, it features a small outline package style, operates in temperatures ranging from -40 to 125 °C, and has a memory density of 2097152 bit.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LRI64-W4/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Terminal Form: NO LEAD;
LRI64-W4/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Maximum Operating Temperature: 85 Cel;
LRI64-W4/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words: 64 words; No. of Functions: 1;
LRI64-SBN18/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; No. of Functions: 1;
LRI64-MBTG/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LRI64-SBN18/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; No. of Words Code: 64;
LRI64-MBTG/3GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Length: 3 mm;
LRI64-SBN18/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Memory Width: 1; Memory Density: 64 bit;
LRI64-MBTG/1XX
LRI64-SBN18/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Memory Width: 1;
LRI64-SBN18/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Minimum Supply Voltage (Vsup): 1.5 V;
LRI64-MBTG/2XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Surface Mount: YES;
LRI64-MBTG/1GE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; No. of Words: 64 words;
LRI64-MBTG/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
LRI64-SBN18/2GE
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Form: NO LEAD; Maximum Supply Voltage (Vsup): 3 V;
LRI64-W4/1XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1; Operating Mode: ASYNCHRONOUS;
LRI64-W4/3XX
MEMORY CIRCUIT; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words Code: 64; Minimum Supply Voltage (Vsup): 1.5 V;
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