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74V2G241STR

STMicroelectronics

74V2G241STR by STMicroelectronics

74V2G241STR by STMicroelectronics is a dual bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact low-profile package and supports military-grade temperatures from -55 °C to 125 °C. Ideal for high-speed data transmission in demanding applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,035 parts In-Stock

1+ parts

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2,035

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Anansix

USA . 290 parts In-Stock

1+ parts

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290

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Vyrian

USA . 197 parts In-Stock

1+ parts

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197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 117 parts In-Stock

1+ parts

$5.839

100+ parts

-

1k+ parts

$5.605

10k+ parts

$5.605

117

$5.839

-

$5.605

$5.605

IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$25.568

100+ parts

-

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$23.011

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2,260

$25.568

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$23.011

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MKK Technologies

India . 1,808 parts In-Stock

1+ parts

$48.078

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1,808

$48.078

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DigiPath Technology Company

USA . 1,808 parts In-Stock

1+ parts

$48.078

100+ parts

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1,808

$48.078

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Native Components

USA . 289 parts In-Stock

1+ parts

$90.950

100+ parts

-

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10k+ parts

$87.312

289

$90.950

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-

$87.312

Northwest PG Solutions

USA . 563 parts In-Stock

1+ parts

$100.045

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563

$100.045

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Corphita

USA . 3,958 parts In-Stock

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3,958

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Parana Technologies

USA . 401 parts In-Stock

1+ parts

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$30.570

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401

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$30.570

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Overview

Elevate your designs with the 74V2G241STR from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile bus driver offers superior performance with minimal propagation delay, ensuring seamless data transfer in critical applications. Its low-profile surface mount design and robust temperature range make it ideal for automotive, industrial, and consumer electronics. Choose STMicroelectronics for quality, reliability, and unmatched support—your gateway to cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and protects against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures fast data transfer rates, making this bus driver/transceiver ideal for high-speed applications.

Surface Mount: YES

Surface mount technology facilitates easier and more compact PCB designs, saving space and improving performance.

No. of Functions: 2

With two functions, this device can be utilized for multiple purposes, adding flexibility to circuit design and reducing component count.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on PCBs, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3 V makes the device compatible with most modern digital circuits, enhancing design versatility.

Load Capacitance (CL): 50 pF

A moderate load capacitance allows for effective signal transmission while minimizing signal degradation, contributing to reliable performance.

Power Supplies (V): 2/5.5

The device supports a wide range of supply voltages, making it versatile and compatible with various applications and systems.

No. of Terminals: 8

With eight terminals, this device provides sufficient connectivity options while maintaining compact dimensions.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Its low-profile design allows for space-saving on PCBs, beneficial for compact electronic designs.

Maximum I (ol): 0.05 Amp

The ability to handle a maximum output current of 0.05 Amp makes this bus driver suitable for multiple applications without overheating.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay ensures predictable and reliable timing characteristics in high-speed data applications.

Maximum Operating Temperature: 125 °C

The device's ability to operate at high temperatures (up to 125 °C) ensures reliability in demanding environments.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for versatile interfacing in bus systems, preventing bus contention.

Minimum Operating Temperature: -55 °C

Capability to function at low temperatures (-55 °C) makes it suitable for extreme environmental applications, including military and aerospace.

Terminal Position: DUAL

The dual terminal position supports versatile mounting options, making it easy to integrate into various circuit designs.

No. of Ports: 2

Having two ports provides flexibility in communication, allowing for more complex data transmission pathways.

Maximum Seated Height: 1.45 mm

A low seated height contributes to the overall compactness of the design, making it suitable for densely packed PCBs.

Width: 1.625 mm

A minimal width allows for efficient use of space on the PCB, promoting compact device design.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, streamlining integration into various circuit designs.

Minimum Supply Voltage (Vsup): 2 V

Works well even at lower supply voltages, making it energy-efficient and suitable for battery-powered devices.

Length: 2.9 mm

A short length supports compact installations, allowing for densely packed electronic assemblies.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring high reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption, making the device efficient for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring reliable connections.

Packing Method: TR

Tape and reel (TR) packing facilitates automated assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm optimizes PCB space without compromising connection integrity.

Control Type: ENABLE LOW/HIGH

Flexible control options allow for versatile integration into varying circuit designs, enhancing user adaptability.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage ensures compatibility with a wide range of systems, providing design flexibility.

Technical Specifications

Bus Driver & Transceivers 74V2G241STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW/HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.05 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G241STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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