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74V2G384CTR

STMicroelectronics

74V2G384CTR by STMicroelectronics

74V2G384CTR by STMicroelectronics is a dual bus driver with a 3.3V nominal voltage and operates in extreme temperatures from -55 °C to 125°C. It features a fast propagation delay of just 2 ns and supports true output polarity. Ideal for military applications, it comes in an 8-terminal thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,142 parts In-Stock

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Digiode

USA . 1,777 parts In-Stock

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1,777

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Vyrian

USA . 411 parts In-Stock

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411

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Distributors (Availability)

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Native Components

USA . 60 parts In-Stock

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$0.676

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60

$0.676

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Northwest PG Solutions

USA . 9 parts In-Stock

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$0.743

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9

$0.743

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Andel Nordic

Denmark . 548 parts In-Stock

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$7.069

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$6.786

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$6.786

548

$7.069

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$6.786

$6.786

IDEA Electronic Components Group

UK . 1,314 parts In-Stock

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$24.124

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$21.712

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1,314

$24.124

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$21.712

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MKK Technologies

India . 133 parts In-Stock

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$45.364

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$45.364

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DigiPath Technology Company

USA . 133 parts In-Stock

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$45.364

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Corphita

USA . 2,360 parts In-Stock

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Parana Technologies

USA . 2,298 parts In-Stock

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$28.844

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$28.844

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Overview

Unlock unparalleled performance with the 74V2G384CTR from STMicroelectronics, a premier choice in bus drivers and transceivers. Renowned for their commitment to excellence, STMicroelectronics delivers robust reliability and superior quality in every component. This versatile device operates seamlessly across various applications, ensuring efficient data transmission while maintaining low power consumption. Elevate your projects with a trusted solution that guarantees durability, precision, and enhanced functionality, making it an essential asset for any design engineer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring long-term performance.

Surface Mount: YES

Surface mount technology allows for compact designs and integration into high-density PCBs.

No. of Functions: 2

Having two functions enhances versatility and enables more complex applications in a single package.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient board layout and maximizes space utilization.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V aligns with many modern digital applications, making it widely compatible.

Power Supplies: 3.3/5 V

Dual supply options increase flexibility for designers, allowing use in various system configurations.

No. of Terminals: 8

Eight terminals provide adequate pin connections, facilitating optimal electrical performance and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small and thin profile saves board space, making it suitable for compact electronic designs.

Propagation Delay (tpd): 2 ns

A low propagation delay of 2 ns ensures fast signal processing, critical for high-speed applications.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures makes this product suitable for harsh environments, such as automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output capability allows for better bus management, reducing contention on shared signal lines.

Minimum Operating Temperature: -55 °C

Operating in extreme cold ensures reliability in diverse environments, especially in aerospace and military applications.

Terminal Position: DUAL

Dual terminal position enhances solderability and provides design flexibility on limited space layouts.

No. of Ports: 2

Two ports facilitate multiple device connections, promoting intercommunication within systems.

Maximum Seated Height: 1.1 mm

A low seated height offers advantages in space-constrained applications, promoting streamlined product designs.

Width: 1.25 mm

The narrow width improves fitting within small spaces on circuit boards, accommodating modern design requirements.

Output Polarity: TRUE

True output polarity simplifies design considerations for various applications and ensures predictable operation.

Minimum Supply Voltage (Vsup): 3 V

Starting from a minimum supply voltage of 3 V ensures compatibility with low-voltage logic systems.

Length: 2 mm

A compact length enhances the integration possibilities in densely packed layout scenarios.

Temperature Grade: MILITARY

Military-grade temperature specifications guarantee performance in rigorous and extreme conditions.

Technology: CMOS

CMOS technology is energy-efficient, providing lower power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and improved soldering quality during assembly.

Packing Method: TR

Tape and reel packing allows for automated assembly processes and easy handling in manufacturing.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch accommodates smaller devices and helps meet the demands of high-density circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate up to 5.5 V provides flexibility for applications that may require higher voltage levels.

Technical Specifications

Bus Driver & Transceivers 74V2G384CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G384CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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