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74V2T125CTR

STMicroelectronics

74V2T125CTR by STMicroelectronics

74V2T125CTR by STMicroelectronics is a dual bus driver with a propagation delay of just 8.5 ns, operating at a nominal voltage of 5 V. It features a compact SOIC package and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed data transmission in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,792 parts In-Stock

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3,792

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Anansix

USA . 588 parts In-Stock

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588

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Vyrian

USA . 204 parts In-Stock

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204

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 379 parts In-Stock

1+ parts

$8.354

100+ parts

-

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$8.020

10k+ parts

$8.020

379

$8.354

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$8.020

$8.020

IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$9.637

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-

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$8.673

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1,820

$9.637

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$8.673

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MKK Technologies

India . 1,414 parts In-Stock

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$18.122

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$18.122

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DigiPath Technology Company

USA . 1,414 parts In-Stock

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$18.122

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1,414

$18.122

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Native Components

USA . 971 parts In-Stock

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$68.873

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$66.118

971

$68.873

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$66.118

Northwest PG Solutions

USA . 2,232 parts In-Stock

1+ parts

$75.760

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2,232

$75.760

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Corphita

USA . 3,868 parts In-Stock

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3,868

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Parana Technologies

USA . 1,162 parts In-Stock

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$11.522

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$11.522

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Overview

Unlock unparalleled performance with the 74V2T125CTR from STMicroelectronics, a trusted leader in reliable semiconductor solutions. Designed for seamless bus driving and transceiving, this compact powerhouse ensures swift data transfer with minimal delay, perfect for automotive, industrial, and communication applications. Enjoy peace of mind with its robust temperature range and cutting-edge technology, elevating your designs while maximizing efficiency and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay allows for faster signal transmission, making this bus driver and transceiver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making integration into existing systems easier.

No. of Functions: 2

Having two functions increases versatility, allowing users to implement more complex operations without needing additional components.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for space-saving layouts on circuit boards, enhancing overall design efficiency.

Nominal Supply Voltage / Vsup: 5 V

Operates on a standard and widely supported supply voltage, making it compatible with a broad range of devices.

Power Supplies (V): 5

Powering from a single supply voltage simplifies design and reduces component complexity.

No. of Terminals: 8

An 8-terminal configuration offers sufficient connectivity for most applications, providing flexibility in design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on PCBs and allow for more compact device design.

Maximum I (ol): 8 Amp

The ability to handle up to 8 Amps makes this product suitable for robust applications that require high current handling.

Propagation Delay (tpd): 8.5 ns

A consistent 8.5 ns propagation delay ensures reliable performance across multiple instances of data transmission.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures ensures reliability in demanding environments.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in control signals, allowing multiple devices to be connected to a common bus.

Minimum Operating Temperature: -55 °C

A wide temperature range allows for operation in extreme conditions, making it suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options on the PCB, aiding in better heat dissipation and signal integrity.

No. of Ports: 2

Two ports facilitate communication between multiple devices, enhancing networking capability.

Maximum Seated Height: 1.1 mm

The low seated height is advantageous for applications requiring minimal profiling, enhancing overall design aesthetics.

Width: 1.25 mm

A narrow width allows for high-density packing on PCBs, which is crucial in space-constrained designs.

Output Polarity: TRUE

The true output polarity indicates simple signal interpretation, making it user-friendly in applications.

Minimum Supply Voltage (Vsup): 4.5 V

Operating down to 4.5 V expands the range of potential applications, accommodating devices with lower voltage requirements.

Length: 2 mm

A compact length is ideal for small form factor devices, allowing for more efficient designs.

Temperature Grade: MILITARY

MIL-STD qualification ensures the product meets rigorous standards for reliability in military applications.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this device efficient and robust.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring a robust connection to PCB.

Packing Method: TR

Tape and reel packing simplifies automated assembly processes, increasing manufacturing efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density applications, optimizing space utilization on PCB.

Control Type: ENABLE LOW

An enable low control type is intuitive and easy to integrate into existing systems without requiring additional logic circuitry.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with standard digital logic levels, enhancing its usability.

Technical Specifications

Bus Driver & Transceivers 74V2T125CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2T125CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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