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74V2G126CTR

STMicroelectronics

74V2G126CTR by STMicroelectronics

74V2G126CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features dual ports and supports up to 4 A output current, making it ideal for high-speed data transmission in military applications. Its compact design ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,223 parts In-Stock

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Anansix

USA . 2,161 parts In-Stock

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Digiode

USA . 1,246 parts In-Stock

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1,246

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Distributors (Availability)

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Andel Nordic

Denmark . 234 parts In-Stock

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$7.509

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-

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$7.208

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$7.208

234

$7.509

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$7.208

$7.208

Native Components

USA . 82 parts In-Stock

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$26.160

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82

$26.160

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Northwest PG Solutions

USA . 2,029 parts In-Stock

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$28.776

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$25.898

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2,029

$28.776

$25.898

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IDEA Electronic Components Group

UK . 658 parts In-Stock

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$30.579

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$27.521

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658

$30.579

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$27.521

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MKK Technologies

India . 2,318 parts In-Stock

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$57.502

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2,318

$57.502

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DigiPath Technology Company

USA . 2,318 parts In-Stock

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$57.502

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Corphita

USA . 4,560 parts In-Stock

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4,560

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Parana Technologies

USA . 688 parts In-Stock

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$36.562

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Overview

Elevate your designs with the 74V2G126CTR from STMicroelectronics—crafted for excellence and reliability. This high-performance bus driver ensures rapid communication with minimal delay, ideal for military and industrial applications. STMicroelectronics' commitment to quality guarantees durability in extreme conditions, making it a trusted choice for engineers seeking efficiency and versatility. Unlock endless possibilities while benefiting from superior engineering and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and helps protect the internal components, making this product suitable for a variety of environments.

Propagation Delay At Nominal Supply: 10.5 ns

With a propagation delay of 10.5 ns, this component provides fast signal processing, making it ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for compact designs and automated assembly, improving manufacturing efficiency.

No. of Functions: 2

Having two functions allows for versatility in design, enabling designers to use fewer components and save space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for layout efficiency, facilitating better space utilization on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3 V is compatible with low-power applications, helping to mitigate energy consumption.

Power Supplies (V): 2/5.5

The ability to operate with supply voltages ranging from 2V to 5.5V provides flexibility in circuit design, accommodating various system requirements.

No. of Terminals: 8

The eight terminals make it easy to integrate this device into circuits, offering multiple points for connection and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile aid in space-saving designs, which is essential for modern electronic applications.

Maximum I (ol): 4 Amp

A maximum output current capability of 4 Amp makes this product suitable for driving higher loads, enhancing its usability in various applications.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay supports reliable performance in fast communication links, ensuring accurate data transfer in high-speed circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enhances the reliability of this product in demanding applications, suitable for automotive and industrial use.

Output Characteristics: 3-STATE

The 3-state output allows for flexible signaling in bus systems, which is essential in multi-device communication circuits.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this component to function in extreme conditions, making it suitable for military and aerospace applications.

Terminal Position: DUAL

Having dual terminal positions aids in simplifying PCB layout and improving connections, thus enhancing the reliability of solder joints.

No. of Ports: 2

Two ports enable dual communication lines, facilitating effective data relay and enhancing the functionality of the device.

Maximum Seated Height: 1.1 mm

The compact seated height maximizes space utilization on the PCB and supports slim designs, ideal for modern electronic devices.

Width: 1.25 mm

A narrow width is advantageous for minimizing board space while maintaining design flexibility in crowded applications.

Output Polarity: TRUE

True output polarity simplifies circuit design and integration with other components, ensuring straightforward operation in various applications.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage requirement of 2V enables compatibility with a wide range of low-voltage digital applications.

Length: 2 mm

Its compact length allows easy placement in tight spaces, enhancing design capabilities without compromising performance.

Temperature Grade: MILITARY

The military-grade temperature classification ensures reliability and performance under harsh environmental conditions, essential for critical applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making it a preferred choice for battery-powered and sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal design facilitates easy soldering and improves the mechanical connection with the PCB, ensuring robust physical attachment.

Packing Method: TR

The tape and reel packing method eases logistics and automates assembly processes, contributing to efficient manufacturing workflows.

Terminal Pitch: 0.5 mm

The smaller terminal pitch is suitable for high-density designs, catering to modern electronic trends toward miniaturization.

Control Type: ENABLE HIGH

The ENABLE HIGH control type ensures straightforward implementation in circuit designs, simplifying the interface with microcontrollers or other digital logic devices.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides headroom for operation with a range of device configurations, enhancing design flexibility.

Technical Specifications

Bus Driver & Transceivers 74V2G126CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G126CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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