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74V2T241STR

STMicroelectronics

74V2T241STR by STMicroelectronics

74V2T241STR by STMicroelectronics is a dual bus driver with a propagation delay of just 8.5 ns, operating b/w -55 °C to 125 °C. It features a low-profile SO package and supports up to 8A output current. Ideal for military applications, it ensures reliable data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,301 parts In-Stock

1+ parts

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4,301

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Digiode

USA . 2,988 parts In-Stock

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2,988

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Anansix

USA . 2,446 parts In-Stock

1+ parts

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2,446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$7.642

100+ parts

-

1k+ parts

$6.877

10k+ parts

-

1,519

$7.642

-

$6.877

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Andel Nordic

Denmark . 228 parts In-Stock

1+ parts

$8.197

100+ parts

-

1k+ parts

$7.869

10k+ parts

$7.869

228

$8.197

-

$7.869

$7.869

MKK Technologies

India . 1,454 parts In-Stock

1+ parts

$14.369

100+ parts

-

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1,454

$14.369

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DigiPath Technology Company

USA . 1,454 parts In-Stock

1+ parts

$14.369

100+ parts

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10k+ parts

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1,454

$14.369

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Native Components

USA . 850 parts In-Stock

1+ parts

$81.410

100+ parts

-

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10k+ parts

$78.154

850

$81.410

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-

$78.154

Northwest PG Solutions

USA . 1,697 parts In-Stock

1+ parts

$89.551

100+ parts

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1,697

$89.551

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Corphita

USA . 2,533 parts In-Stock

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2,533

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Parana Technologies

USA . 552 parts In-Stock

1+ parts

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$9.137

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552

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$9.137

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Overview

Unlock seamless data communication with the 74V2T241STR from STMicroelectronics, a name synonymous with reliability and innovation. Designed for efficiency, this bus driver excels in various applications, ensuring swift connectivity in demanding environments. Its low power consumption and compact design make it perfect for space-constrained projects. Elevate your designs with ST's commitment to quality, empowering you to deliver outstanding performance and longevity in every solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product reliable for various applications.

Propagation Delay At Nominal Supply: 8.5 ns

With a low propagation delay, this product enables faster signal transmission, improving overall system performance.

Surface Mount: YES

Being surface mount allows for easier and more compact PCB designs, making it ideal for space-constrained applications.

No. of Functions: 2

Featuring multiple functions, this product provides versatility and flexibility, making it suitable for various use cases.

Package Shape: RECTANGULAR

The rectangular package shape is standard and facilitates easy integration into different circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is optimal for compatibility with many digital systems.

Load Capacitance (CL): 50 pF

A low load capacitance minimizes signal distortion, leading to enhanced signal integrity in high-frequency applications.

Power Supplies (V): 5

Single power supply requirement reduces complexity in design, making it easier to integrate into existing circuits.

No. of Terminals: 8

With eight terminals, this product provides sufficient connections for various applications while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This low-profile package style is ideal for applications with limited space, enhancing design flexibility.

Maximum I (ol): 8 Amp

A high output current capacity of 8 Amps allows the product to drive heavy loads, beneficial in power-hungry applications.

Propagation Delay (tpd): 8.5 ns

Consistent low propagation delay ensures minimal lag in processing signals, crucial for high-speed digital communication.

Maximum Operating Temperature: 125 °C

This high operating temperature range ensures reliability in extreme conditions, suitable for military and industrial applications.

Output Characteristics: 3-STATE

3-state output functionality allows for better control in bus applications, enhancing system interconnectivity.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures makes this product suitable for harsh environments, such as aerospace and military use.

Terminal Position: DUAL

Dual terminal positioning offers flexible design options, allowing for better layout adaptability.

No. of Ports: 2

Having two ports increases connectivity options, enabling effective control in multi-device communication.

Maximum Seated Height: 1.45 mm

The low seated height contributes to a cleaner PCB design, facilitating tight assembly configurations.

Width: 1.625 mm

A narrow width enhances placement flexibility on PCBs, ideal for dense layouts.

Output Polarity: TRUE

True output polarity standardizes integration with other logic gates, ensuring smooth operation in circuits.

Minimum Supply Voltage (Vsup): 4.5 V

This lower supply voltage requirement allows for compatibility with a variety of power supply circuits.

Length: 2.9 mm

A compact length enables efficient use of board space, especially important in miniaturized electronics.

Temperature Grade: MILITARY

This military-grade specification assures robustness and reliability under demanding conditions, ideal for critical applications.

Technology: CMOS

CMOS technology enhances power efficiency and reduces heat generation, making it suitable for low-power applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting, improving assembly efficiency in production.

Packing Method: TR

Through-hole (TR) packaging simplifies handling and integration during manufacturing, ensuring reliable assembly.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for compact layouts and increased density in PCB designs.

Control Type: ENABLE LOW/HIGH

The ENABLE control feature allows easy activation and deactivation of the device, enhancing operational control in circuits.

Maximum Supply Voltage (Vsup): 5.5 V

This maximum supply voltage ensures compatibility with various logic levels while providing some design flexibility.

Technical Specifications

Bus Driver & Transceivers 74V2T241STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW/HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2T241STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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