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74V2T125STR

STMicroelectronics

74V2T125STR by STMicroelectronics

74V2T125STR by STMicroelectronics is a dual bus driver with a propagation delay of just 8.5 ns, operating at a nominal voltage of 5V. It features a compact low-profile package and supports military-grade temperatures from -55 °C to 125°C. Ideal for high-speed data transmission in space-constrained applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,981 parts In-Stock

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Digiode

USA . 4,989 parts In-Stock

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4,989

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Anansix

USA . 859 parts In-Stock

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859

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Bristol Electronics

USA . 680 parts In-Stock

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680

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Atlantic Semiconductor

USA . 680 parts In-Stock

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680

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Distributors (Availability)

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Andel Nordic

Denmark . 385 parts In-Stock

1+ parts

$3.782

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-

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$3.631

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$3.631

385

$3.782

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$3.631

$3.631

AZTECH Wire

Italy . 578 parts In-Stock

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$15.580

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578

$15.580

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$15.712

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$14.298

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$12.884

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500

$15.712

$14.298

$12.884

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IDEA Electronic Components Group

UK . 1,107 parts In-Stock

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$19.257

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$17.332

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$19.257

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$17.332

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Microchip USA

USA . 277 parts In-Stock

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$19.406

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277

$19.406

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MKK Technologies

India . 2,203 parts In-Stock

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$36.212

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$36.212

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DigiPath Technology Company

USA . 2,203 parts In-Stock

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$36.212

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$36.212

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Corphita

USA . 2,466 parts In-Stock

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Northwest PG Solutions

USA . 1,933 parts In-Stock

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Parana Technologies

USA . 1,614 parts In-Stock

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$23.025

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$23.025

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Native Components

USA . 789 parts In-Stock

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789

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Overview

Elevate your designs with the 74V2T125STR from STMicroelectronics, a powerhouse in bus driver and transceiver technology. Engineered for efficiency and reliability, this high-performance component delivers rapid data transfer with minimal delay, ensuring superior system responsiveness. With its robust military-grade specifications, it thrives in demanding environments. Trust STMicroelectronics for unparalleled quality that empowers your applications—from industrial automation to consumer electronics—while maximizing operational performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances the reliability and longevity of the product in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay ensures faster signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs, making the product ideal for modern, space-constrained electronic circuits.

No. of Functions: 2

With dual functions, this device can perform multiple tasks, adding versatility and efficiency to your circuit design.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout on PCB, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5 V makes this product compatible with a wide range of power supply systems.

Power Supplies (V): 5

Designed for 5V power supplies, it aligns well with common digital logic levels, ensuring easy integration.

No. of Terminals: 8

Eight terminals provide ample connectivity options, making the device flexible for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile, shrink pitch design is perfect for high-density mounting applications, conserving board space.

Maximum I (ol): 8 Amp

With a high output current rating of 8 Amps, the product can drive substantial loads, enhancing its application range.

Propagation Delay (tpd): 8.5 ns

Maintaining a consistent 8.5 ns propagation delay ensures stable and reliable performance in high-speed data transmission.

Maximum Operating Temperature: 125 °C

This temperature tolerance allows the product to function efficiently in demanding environments.

Output Characteristics: 3-STATE

The 3-state output characterizes the product's ability to control data flow, enhancing its versatility in digital applications.

Minimum Operating Temperature: -55 °C

The wide temperature range (-55 °C to 125°C) ensures reliable operation in extreme conditions.

Terminal Finish: TIN

A tin terminal finish provides good solderability and ensures long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning offers flexible layout options for PCB design.

No. of Ports: 2

With two ports, the device can facilitate efficient data transfer between different components.

Maximum Seated Height: 1.45 mm

The low seated height is advantageous for compact designs, allowing for efficient layering of components.

Width: 1.625 mm

A narrow width supports placement in tight spaces while maintaining functionality.

Output Polarity: TRUE

The true output polarity ensures that the logic levels are consistent with common digital electronics, improving compatibility.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage requirement of 4.5 V supports a wide range of application scenarios.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness to withstand common soldering processes.

Length: 2.9 mm

The short length helps in optimizing PCB real estate, particularly in dense configurations.

Temperature Grade: MILITARY

The military grade certification assures the product's reliability under severe environmental conditions.

Technology: CMOS

CMOS technology offers high speed and low power consumption, making the device efficient for various applications.

Terminal Form: GULL WING

Gull-wing terminals provide excellent solder joint stability and are preferred for automated assembly processes.

Packing Method: TR

The tape and reel packing method facilitates automated handling and assembly, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports compatibility with modern PCB designs and helps in density optimization.

Control Type: ENABLE LOW

The 'ENABLE LOW' control type allows for straightforward integration into digital systems, improving ease of use.

Maximum Supply Voltage (Vsup): 5.5 V

The capacity to handle up to 5.5 V ensures compatibility with a range of power supply configurations, enhancing flexibility.

Technical Specifications

Bus Driver & Transceivers 74V2T125STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2T125STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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