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74V2G125STR

STMicroelectronics

74V2G125STR by STMicroelectronics

74V2G125STR by STMicroelectronics is a dual bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports military-grade temperatures from -55 °C to 125°C, ideal for robust applications. Its 3-state output makes it versatile for various digital signal interfacing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,527 parts In-Stock

1+ parts

-

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2,527

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Anansix

USA . 1,994 parts In-Stock

1+ parts

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1k+ parts

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1,994

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Digiode

USA . 1,304 parts In-Stock

1+ parts

-

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1,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 325 parts In-Stock

1+ parts

$3.056

100+ parts

-

1k+ parts

$2.933

10k+ parts

$2.933

325

$3.056

-

$2.933

$2.933

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$8.600

100+ parts

-

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805

$8.600

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IDEA Electronic Components Group

UK . 485 parts In-Stock

1+ parts

$8.757

100+ parts

-

1k+ parts

$7.881

10k+ parts

-

485

$8.757

-

$7.881

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Microchip USA

USA . 304 parts In-Stock

1+ parts

$13.202

100+ parts

-

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304

$13.202

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MKK Technologies

India . 2,157 parts In-Stock

1+ parts

$16.466

100+ parts

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10k+ parts

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2,157

$16.466

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$16.466

100+ parts

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2,157

$16.466

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Native Components

USA . 180 parts In-Stock

1+ parts

$97.004

100+ parts

-

1k+ parts

-

10k+ parts

$93.123

180

$97.004

-

-

$93.123

Component Stockers USA

USA . 595 parts In-Stock

1+ parts

$99.990

100+ parts

-

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595

$99.990

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Northwest PG Solutions

USA . 204 parts In-Stock

1+ parts

$106.704

100+ parts

-

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204

$106.704

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Corphita

USA . 4,926 parts In-Stock

1+ parts

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4,926

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Parana Technologies

USA . 80 parts In-Stock

1+ parts

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100+ parts

$10.470

1k+ parts

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80

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$10.470

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Overview

Unlock unparalleled performance with the 74V2G125STR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality bus driver excels in delivering reliable data transmission across diverse applications, from automotive to industrial systems. With its low-profile design and efficient power handling, it ensures optimal functionality while saving space and energy. Experience enhanced reliability and superior speed, making your designs more effective and future-ready!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection and insulation, making this product suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 10.5 ns

With a low propagation delay, this product ensures fast signaling, ideal for high-speed communication in integrated circuits.

Surface Mount: YES

Designed for surface mounting, this component facilitates automated assembly and saves space on the PCB.

No. of Functions: 2

Having two functions allows for versatile applications, making this component suitable for more complex tasks within a compact design.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space management on PCBs, allowing for higher density designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with modern digital systems, ensuring optimal power consumption.

Power Supplies (V): 2/5.5

The component supports a wide voltage range (2V to 5.5V), providing flexibility for various applications and enhancing compatibility with different systems.

No. of Terminals: 8

The eight terminals facilitate adequate connections for enhanced functionality while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low-profile design make this component suitable for space-constrained applications.

Maximum I (ol): 4 Amp

The ability to handle a maximum output current of 4 Amps ensures this product is effective for driving heavy loads.

Propagation Delay (tpd): 10.5 ns

The same low propagation delay indicates consistency in performance, crucial for timing-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature limit, this component is suitable for use in demanding environments and industrial applications.

Output Characteristics: 3-STATE

The 3-state output functionality allows for greater data handling flexibility, making it suitable for bus systems.

Minimum Operating Temperature: -55 °C

The extended low-temperature operation range signifies reliability in extreme conditions, perfect for military and aerospace applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability, contributing to better connection integrity and reliability in the assembly process.

Terminal Position: DUAL

Dual terminal positioning aids in maximizing routing options on PCBs, enhancing design versatility.

No. of Ports: 2

Having two ports enables dual communication paths, increasing the efficiency and throughput of data transfer.

Maximum Seated Height: 1.45 mm

With a low seated height, this component supports low-profile designs, making it ideal for slim electronic devices.

Width: 1.625 mm

The compact width facilitates space-saving designs, essential for modern electronic applications.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, simplifying integration into existing systems.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage threshold of 2V offers flexibility for low-voltage applications, thereby reducing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Support for a maximum time at peak reflow temperature of 30 seconds aligns with modern soldering processes while minimizing thermal stress.

Peak Reflow Temperature °C: 260

The high reflow temperature compatibility ensures robust operation even under rigorous assembly processes.

Length: 2.9 mm

A compact length enhances space efficiency, which is critical in tightly packed electronic devices.

Temperature Grade: MILITARY

Designed to meet military temperature specifications, it offers superior reliability and performance in critical applications.

Technology: CMOS

Utilizing CMOS technology leads to low power consumption and high noise immunity, crucial for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal design facilitates easy soldering and provides robust mechanical strength.

Packing Method: TR

Tape and reel packing method allows for efficient handling and automated placement in manufacturing.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for high-density component placement, suitable for compact electronic designs.

Control Type: ENABLE LOW

A low-enable control type ensures easy integration into logic control circuits, improving overall design efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for compatibility with a wide variety of systems, enhancing application versatility.

Technical Specifications

Bus Driver & Transceivers 74V2G125STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V2G125STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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