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74V2T384STR

STMicroelectronics

74V2T384STR by STMicroelectronics

74V2T384STR by STMicroelectronics is a dual bus driver with a 5V nominal supply and operates in extreme temperatures from -55 °C to 125 °C. It features a fast propagation delay of just 1.5 ns and supports true output polarity. Ideal for military applications, it comes in a compact SOIC package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,024 parts In-Stock

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Anansix

USA . 2,363 parts In-Stock

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2,363

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Vyrian

USA . 205 parts In-Stock

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205

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Distributors (Availability)

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Microchip USA

USA . 457 parts In-Stock

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$0.394

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457

$0.394

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Andel Nordic

Denmark . 226 parts In-Stock

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$2.576

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$2.473

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$2.473

226

$2.576

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$2.473

IDEA Electronic Components Group

UK . 2,148 parts In-Stock

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$25.790

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$23.211

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2,148

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MKK Technologies

India . 405 parts In-Stock

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$48.497

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405

$48.497

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DigiPath Technology Company

USA . 405 parts In-Stock

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$48.497

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405

$48.497

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QUARKTWIN TECHNOLOGY LTD

USA . 3,541 parts In-Stock

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Northwest PG Solutions

USA . 1,814 parts In-Stock

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Parana Technologies

USA . 1,783 parts In-Stock

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$30.836

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$30.836

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Corphita

USA . 1,267 parts In-Stock

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Native Components

USA . 743 parts In-Stock

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Overview

Unlock superior performance with the 74V2T384STR from STMicroelectronics—a trusted leader in innovative semiconductor solutions. This versatile bus driver and transceiver excels in high-demand applications, delivering fast and reliable data transfer with minimal power consumption. Its compact design and robust temperature range ensure reliability in even the most challenging environments, making it the ideal choice for automotive, industrial, and communication systems. Experience the quality and expertise that comes with STMicroelectronics, empowering your projects with unmatched value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material helps to ensure reliability and longevity in various operating environments.

Surface Mount: YES

The surface mount configuration allows for easier integration into compact designs, saving space on printed circuit boards.

No. of Functions: 2

The dual function capability enhances versatility, making this component suitable for multiple applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of board space, optimizing layout and design flexibility.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V makes this part compatible with a wide range of systems and ensures ease of integration.

Power Supplies (V): 5

A consistent power supply requirement simplifies design considerations and reduces the need for additional voltage regulation.

No. of Terminals: 8

With 8 terminals, this component provides sufficient connectivity for various applications without overcrowding the board.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package style minimizes height while maintaining performance, making it suitable for space-constrained applications.

Propagation Delay (tpd): 1.5 ns

A low propagation delay ensures high-speed performance, crucial for applications requiring quick data transfer and response times.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures increases reliability in demanding environments and industrial applications.

Output Characteristics: 3-STATE

3-state output capability enhances flexibility in data communication, allowing better control over data flow.

Minimum Operating Temperature: -55 °C

A wide temperature range ensures performance in extreme conditions, making it ideal for aerospace and military applications.

Terminal Position: DUAL

Dual terminal positioning improves robustness and ease of soldering during assembly.

No. of Ports: 2

Having two ports helps facilitate communication between multiple devices, enhancing system architecture.

Maximum Seated Height: 1.45 mm

A low seated height allows for dense circuit designs while maintaining electrical performance.

Width: 1.625 mm

The narrow width aids in compact layout configurations, making it versatile for tight spaces.

Output Polarity: TRUE

True output polarity ensures compatibility with other devices in the system, preventing logic conflicts.

Minimum Supply Voltage (Vsup): 4 V

Working at a minimum of 4V offers flexibility in lower-power applications, extending possible use cases.

Length: 2.9 mm

A compact length fits well in small form factors, allowing for versatility in different designs.

Temperature Grade: MILITARY

The military-grade specification ensures robustness and reliability in critical applications, reinforcing quality.

Technology: CMOS

CMOS technology leads to lower power consumption and higher efficiency, making it environmentally friendly.

Terminal Form: GULL WING

Gull wing terminals facilitate easy assembly and improve soldering performance, reducing assembly defects.

Packing Method: TR

Tape and reel (TR) packing makes the component suit automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A small terminal pitch supports dense layout designs, allowing for more functionality in limited space.

Maximum Supply Voltage (Vsup): 5.5 V

Meeting a maximum supply voltage of 5.5V provides a safe operating margin for varied applications.

Technical Specifications

Bus Driver & Transceivers 74V2T384STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

1.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2T384STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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