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74V2G125CTR

STMicroelectronics

74V2G125CTR by STMicroelectronics

74V2G125CTR by STMicroelectronics is a dual bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports military-grade temperatures from -55 °C to 125°C, ideal for robust applications. Its 3-state output makes it versatile for various digital circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,630 parts In-Stock

1+ parts

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2,630

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Digiode

USA . 149 parts In-Stock

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149

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Vyrian

USA . 32 parts In-Stock

1+ parts

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 367 parts In-Stock

1+ parts

$0.760

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367

$0.760

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Northwest PG Solutions

USA . 2,339 parts In-Stock

1+ parts

$0.836

100+ parts

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2,339

$0.836

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Andel Nordic

Denmark . 2,510 parts In-Stock

1+ parts

$8.271

100+ parts

-

1k+ parts

$7.940

10k+ parts

$7.940

2,510

$8.271

-

$7.940

$7.940

IDEA Electronic Components Group

UK . 1,745 parts In-Stock

1+ parts

$22.160

100+ parts

-

1k+ parts

$19.944

10k+ parts

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1,745

$22.160

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$19.944

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MKK Technologies

India . 1,445 parts In-Stock

1+ parts

$41.671

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1,445

$41.671

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$41.671

100+ parts

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1,445

$41.671

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Corphita

USA . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 417 parts In-Stock

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$26.496

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417

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$26.496

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Overview

Unlock the power of innovation with the 74V2G125CTR from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance bus driver delivers exceptional speed and reliability, perfect for applications demanding precision in harsh environments. Its compact design ensures seamless integration while minimizing space. With ST's commitment to quality, you gain not just a component, but a strategic advantage that enhances your designs and accelerates your time to market. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product can withstand various environmental conditions, making it reliable for long-term applications.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay ensures faster signal transmission, enhancing overall system performance and efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly on PCBs, optimizing space utilization within the circuit.

No. of Functions: 2

Having multiple functions in a single chip reduces the need for additional components, simplifying design and reducing costs.

Package Shape: RECTANGULAR

The rectangular shape promotes efficient space usage on a PCB, allowing for denser circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with many modern digital systems, ensuring versatility.

Power Supplies (V): 2/5.5

The capability to operate between 2V and 5.5V allows this device to be used in a wide range of applications, providing flexibility.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for integration into various circuits without overcrowding.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate integration into compact devices, making it suitable for space-constrained applications.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows the device to drive heavy loads, ensuring it can handle demanding applications.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay ensures predictable performance, which is critical for synchronous systems.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating indicates robustness and reliability in harsh environments.

Output Characteristics: 3-STATE

3-state output capability allows for greater flexibility in signal management within multi-device communications.

Minimum Operating Temperature: -55 °C

A wide temperature range makes this device suitable for extreme conditions, particularly in military or aerospace applications.

Terminal Position: DUAL

Dual terminal positions enable efficient connectivity and flexibility in circuit design.

No. of Ports: 2

Having two ports allows for simultaneous data transfers, enhancing performance in multi-channel applications.

Maximum Seated Height: 1.1 mm

The low profile design minimizes the height of the mounted device, which is beneficial for compact electronic assemblies.

Width: 1.25 mm

A narrow width facilitates space-efficient layout on the board, ideal for high-density designs.

Output Polarity: TRUE

True output polarity enables reliable interfacing with other circuitry, maintaining signal integrity.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum voltage of 2V allows use in low-power applications, enhancing energy efficiency.

Length: 2 mm

A compact length supports integration into small devices without compromising on performance.

Temperature Grade: MILITARY

This military-grade classification ensures high reliability and performance in mission-critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, which are vital for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals provide easier soldering and better thermal performance, enhancing manufacturability.

Packing Method: TR

Tape and reel packaging allows for efficient handling and automated assembly processes, reducing production time.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections, suitable for advanced electronic applications.

Control Type: ENABLE LOW

Having a low-enable control type simplifies integration into existing systems and provides better control over power consumption.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate up to 5.5V ensures compatibility with a wide range of logic circuits.

Technical Specifications

Bus Driver & Transceivers 74V2G125CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2G125CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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