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74V2T384CTR

STMicroelectronics

74V2T384CTR by STMicroelectronics

74V2T384CTR by STMicroelectronics is a dual bus driver with a 5V nominal voltage and operates in extreme temperatures from -55 °C to 125 °C. It features a fast propagation delay of just 1.5 ns and supports 3-state output characteristics. Ideal for military applications, it comes in a compact SOIC-8 package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,573 parts In-Stock

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2,573

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Digiode

USA . 1,337 parts In-Stock

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1,337

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Vyrian

USA . 276 parts In-Stock

1+ parts

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276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 77 parts In-Stock

1+ parts

$5.519

100+ parts

-

1k+ parts

$5.298

10k+ parts

$5.298

77

$5.519

-

$5.298

$5.298

IDEA Electronic Components Group

UK . 294 parts In-Stock

1+ parts

$7.446

100+ parts

-

1k+ parts

$6.702

10k+ parts

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294

$7.446

-

$6.702

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MKK Technologies

India . 362 parts In-Stock

1+ parts

$14.003

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362

$14.003

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DigiPath Technology Company

USA . 362 parts In-Stock

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$14.003

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362

$14.003

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Native Components

USA . 80 parts In-Stock

1+ parts

$425.454

100+ parts

$416.945

1k+ parts

$412.691

10k+ parts

$408.436

80

$425.454

$416.945

$412.691

$408.436

Northwest PG Solutions

USA . 2,178 parts In-Stock

1+ parts

$468.000

100+ parts

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2,178

$468.000

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Corphita

USA . 4,781 parts In-Stock

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4,781

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Parana Technologies

USA . 1,675 parts In-Stock

1+ parts

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$8.903

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1,675

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$8.903

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Overview

Elevate your designs with the 74V2T384CTR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance bus driver and transceiver delivers exceptional reliability for your applications, ensuring seamless data communication even in extreme conditions. With its compact design and robust thermal characteristics, it’s perfect for everything from automotive to industrial controls. Trust STMicroelectronics for quality that empowers your projects and drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection for the internal components, making it suitable for various applications.

Surface Mount: YES

Surface mount capabilities enhance the integration of the product into compact electronic designs, saving space and improving assembly efficiency.

No. of Functions: 2

With two functions, this product offers versatility, allowing it to handle multiple tasks within a single device.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on printed circuit boards (PCBs), making it easier to design compact systems.

Nominal Supply Voltage / Vsup: 5V

The standard 5V supply voltage ensures compatibility with a wide range of digital systems and power supplies.

Power Supplies (V): 5

This product operates with a 5V power supply, which is a common voltage level in electronic applications, ensuring easy integration.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for routing signals, allowing it to fit seamlessly into complex circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained applications where every millimeter counts.

Propagation Delay (tpd): 1.5 ns

A low propagation delay of 1.5 ns ensures fast signal processing, which is crucial for high-speed applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this component can function reliably in demanding environments.

Output Characteristics: 3-STATE

The 3-state output allows for versatile data handling, enabling easier control of connections in bus systems.

Minimum Operating Temperature: -55 °C

This wide temperature range allows the product to be used in extreme conditions, making it suitable for military and aerospace applications.

Terminal Position: DUAL

The dual terminal position enhances layout flexibility on PCBs, making it easier to position and connect the device.

No. of Ports: 2

With two ports, this product supports parallel connections, providing greater efficiency in data transfer.

Maximum Seated Height: 1.1 mm

A low seated height maximizes space savings on the PCB while ensuring compatibility with other components.

Width: 1.25 mm

A compact width allows for denser PCB layouts, making it a good choice for modern electronics.

Output Polarity: TRUE

The true output polarity enhances compatibility with logic levels in digital circuits, making integration straightforward.

Minimum Supply Voltage (Vsup): 4 V

With a minimum supply voltage of 4V, this product can operate under a range of power conditions, increasing its versatility.

Length: 2 mm

A short length contributes to a compact footprint, which is beneficial for miniaturized electronic applications.

Temperature Grade: MILITARY

The military grade specification indicates robustness and reliability under harsh conditions, making it suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated and sensitive devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, ensuring a strong and reliable connection during assembly.

Packing Method: TR

This packing method enables easy handling and integration into automated assembly processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density PCB designs, accommodating more components in a limited area.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum of 5.5V ensures stable operation under varying supply conditions, making it suitable for numerous applications.

Technical Specifications

Bus Driver & Transceivers 74V2T384CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G8

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.09,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

1.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V2T384CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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