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74V2T126STR

STMicroelectronics

74V2T126STR by STMicroelectronics

74V2T126STR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, supporting dual functions and operating temperatures from -55 °C to 125°C. It features a compact SOIC package and handles up to 8A output current. Ideal for military applications, it ensures reliable performance in demanding environments.

Median Price

$0.375

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,164 parts In-Stock

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Anansix

USA . 1,580 parts In-Stock

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1,580

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Bristol Electronics

USA . 975 parts In-Stock

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-

100+ parts

$0.375

1k+ parts

$0.150

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975

-

$0.375

$0.150

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Digiode

USA . 776 parts In-Stock

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776

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 458 parts In-Stock

1+ parts

$2.731

100+ parts

-

1k+ parts

$2.622

10k+ parts

$2.622

458

$2.731

-

$2.622

$2.622

Microchip USA

USA . 150 parts In-Stock

1+ parts

$8.288

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-

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150

$8.288

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AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$8.530

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-

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732

$8.530

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

1+ parts

$13.223

100+ parts

-

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$11.901

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1,189

$13.223

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$11.901

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MKK Technologies

India . 1,413 parts In-Stock

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$24.865

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1,413

$24.865

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DigiPath Technology Company

USA . 1,413 parts In-Stock

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$24.865

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1,413

$24.865

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$28.947

100+ parts

$26.342

1k+ parts

$23.737

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-

3,000

$28.947

$26.342

$23.737

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Ampacity Inc.

Singapore . 510 parts In-Stock

1+ parts

$34.000

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510

$34.000

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Component Stockers USA

USA . 465 parts In-Stock

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$99.990

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465

$99.990

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Corphita

USA . 2,936 parts In-Stock

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2,936

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RC Electronics

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 2,314 parts In-Stock

1+ parts

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$15.810

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2,314

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$15.810

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A-Z Elektronik GmbH

Germany . 1,890 parts In-Stock

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1,890

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Native Components

USA . 731 parts In-Stock

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731

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Northwest PG Solutions

USA . 348 parts In-Stock

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348

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Overview

Elevate your designs with the 74V2T126STR from STMicroelectronics— a trusted leader in semiconductor innovation. This high-performance bus driver offers rapid propagation delays for seamless data transmission, ensuring efficiency and reliability in demanding applications. Its low-profile design fits perfectly in space-constrained environments, while robust thermal characteristics guarantee operation even in extreme conditions. Experience enhanced functionality and value that empowers your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay ensures faster signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into automated assembly processes.

No. of Functions: 2

Having two functions in one package increases versatility and can reduce board space and component counts.

Package Shape: RECTANGULAR

The rectangular shape enables efficient layout and space management on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes it compatible with a wide range of devices.

Power Supplies (V): 5

A consistent power supply requirement simplifies design and facilitates integration with existing systems.

No. of Terminals: 8

With 8 terminals, this device can easily accommodate various connections while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low profile design enhances space-efficiency, making it suitable for compact electronic devices.

Maximum I (ol): 8 Amp

A maximum output current of 8A allows this product to handle significant load capacity, suitable for high-power applications.

Propagation Delay (tpd): 8.5 ns

Similar to the nominal supply, a propagation delay of 8.5 ns supports high-frequency operational needs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating indicates robustness and suitability for demanding environments.

Output Characteristics: 3-STATE

3-state output characteristics enhance functionality by allowing multiple devices to share communication lines.

Minimum Operating Temperature: -55 °C

This wide operating temperature range allows for use in extreme conditions, making it ideal for military and aerospace applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates a compact layout and compatibility with various circuit configurations.

No. of Ports: 2

Two ports enable connecting multiple devices, enhancing the product’s functionality and utility.

Maximum Seated Height: 1.45 mm

A low seated height contributes to a sleek design, perfect for space-constrained applications.

Width: 1.625 mm

The narrow width aids in compact PCB designs and eases integration into existing systems.

Output Polarity: TRUE

True output polarity ensures reliable signal integrity, reducing potential for errors in communication.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for lower power applications, improving energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds provides adequate processing time during assembly while maintaining component integrity.

Peak Reflow Temperature °C: 260

High reflow temperature tolerances enable compatibility with modern manufacturing techniques.

Length: 2.9 mm

A compact length contributes to a smaller footprint, making it ideal for portable applications.

Temperature Grade: MILITARY

Rated for military temperature standards, ensuring reliability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, suitable for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Packing Method: TR

The tape and reel packing method ensures efficient handling and automated assembly processes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense configurations on PCBs, maximizing space utilization.

Control Type: ENABLE HIGH

Enable high control type simplifies logic control, facilitating straightforward integration in digital circuits.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V offers flexibility in power supply options, accommodating various designs.

Technical Specifications

Bus Driver & Transceivers 74V2T126STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V2T126STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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