Loading...

74V2G126STR

STMicroelectronics

74V2G126STR by STMicroelectronics

74V2G126STR by STMicroelectronics is a dual bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports high-speed data transmission in military applications. With a max temp of 125 °C, it's ideal for harsh environments.

Median Price

$0.685

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 3 parts In-Stock

1+ parts

$0.685

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$0.685

-

-

-

Vyrian

USA . 3,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,755

-

-

-

-

Digiode

USA . 1,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,582

-

-

-

-

Anansix

USA . 636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

636

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 55 parts In-Stock

1+ parts

$3.793

100+ parts

-

1k+ parts

$3.641

10k+ parts

$3.641

55

$3.793

-

$3.641

$3.641

IDEA Electronic Components Group

UK . 1,042 parts In-Stock

1+ parts

$12.763

100+ parts

-

1k+ parts

$11.487

10k+ parts

-

1,042

$12.763

-

$11.487

-

AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$14.010

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$14.010

-

-

-

MKK Technologies

India . 876 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$24.000

-

-

-

DigiPath Technology Company

USA . 876 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$24.000

-

-

-

Native Components

USA . 17 parts In-Stock

1+ parts

$726.350

100+ parts

$711.823

1k+ parts

$704.559

10k+ parts

$697.296

17

$726.350

$711.823

$704.559

$697.296

Northwest PG Solutions

USA . 2,071 parts In-Stock

1+ parts

$798.985

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

$798.985

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,521

-

-

-

-

Microchip USA

USA . 4,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,149

-

-

-

-

Corphita

USA . 1,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,548

-

-

-

-

Parana Technologies

USA . 206 parts In-Stock

1+ parts

-

100+ parts

$15.260

1k+ parts

-

10k+ parts

-

206

-

$15.260

-

-

Overview

Elevate your design with the 74V2G126STR from STMicroelectronics, a trusted leader in semiconductor innovation. This dual bus driver and transceiver delivers exceptional performance, ensuring rapid signal propagation and robust data integrity. Its compact, low-profile design is perfect for space-constrained applications, while MIL-grade durability guarantees reliability even in extreme conditions. Empower your projects with unmatched quality and efficiency—transforming ideas into reality has never been easier!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures protection against environmental factors, enhancing the reliability of the product.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures faster signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCBs and facilitates automated assembly.

No. of Functions: 2

Having multiple functions increases versatility, allowing for more complex circuit designs without additional components.

Package Shape: RECTANGULAR

The rectangular package shape promotes easier placement on circuit boards and efficient space management.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with modern digital circuits, enhancing its utility.

Power Supplies (V): 2/5.5

Supports a wide range of supply voltages, making the product adaptable to various applications and configurations.

No. of Terminals: 8

The 8 terminals facilitate multiple connections, increasing integration capabilities in circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style saves board space and is perfect for compact designs, making it ideal for portable devices.

Maximum I (ol): 4 Amp

The ability to output up to 4 Amps ensures it can drive loads effectively, suitable for demanding applications.

Propagation Delay (tpd): 10.5 ns

Reiterating low propagation delay, it guarantees fast performance in signal processing tasks.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it is reliable for use in harsh environments, ensuring system stability.

Output Characteristics: 3-STATE

3-state output allows greater flexibility in circuit designs, enabling multiple connections without conflicts.

Minimum Operating Temperature: -55 °C

This wide temperature range allows for operation in extreme conditions, ideal for military and aerospace applications.

Terminal Finish: TIN

Tin finish enhances solderability, facilitating easier assembly and ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for efficient layout and design flexibility on circuit boards.

No. of Ports: 2

Two ports expand connection capabilities, allowing for more complex configurations in embedded systems.

Maximum Seated Height: 1.45 mm

A low profile reduces the overall height of designs, allowing for thinner device profiles.

Width: 1.625 mm

Compact width facilitates integration into tight spaces, making it suitable for miniaturized electronics.

Output Polarity: TRUE

True output polarity provides predictable behavior in circuits, simplifying design requirements.

Minimum Supply Voltage (Vsup): 2 V

This low minimum supply voltage ensures compatibility with battery-powered applications, enhancing efficiency.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates durability during assembly processes, ensuring overall product longevity.

Length: 2.9 mm

Short length contributes to space savings, perfect for designs where real estate on PCB is a critical constraint.

Temperature Grade: MILITARY

Military-grade specifications guarantee higher reliability and performance in challenging environments, ideal for critical applications.

Technology: CMOS

CMOS technology delivers low power consumption while maintaining high-speed performance, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability and mechanical stability, improving overall assembly quality.

Packing Method: TR

The TR packing method promotes efficient handling and storage, ensuring ease of use in production environments.

Terminal Pitch: 0.65 mm

A standard terminal pitch allows for compatibility with various PCB designs, facilitating integration into existing systems.

Control Type: ENABLE HIGH

Enable high control type simplifies signal management, providing straightforward integration into control logic.

Maximum Supply Voltage (Vsup): 5.5 V

Flexible maximum supply voltage accommodates various power requirements, making the product versatile for different applications.

Technical Specifications

Bus Driver & Transceivers 74V2G126STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.1

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V2G126STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 13