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74LX1G86CTR

STMicroelectronics

74LX1G86CTR by STMicroelectronics

74LX1G86CTR by STMicroelectronics is a CMOS logic gate with a fast propagation delay of 5 ns and operates at supply voltages from 1.65V to 5.5V. It features dual inputs and is ideal for compact, high-speed applications in military environments. Its small outline package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,631 parts In-Stock

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Anansix

USA . 1,563 parts In-Stock

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1,563

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Digiode

USA . 1,267 parts In-Stock

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1,267

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Distributors (Availability)

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Native Components

USA . 255 parts In-Stock

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$0.118

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-

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$0.113

255

$0.118

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$0.113

Northwest PG Solutions

USA . 2,162 parts In-Stock

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$0.130

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$0.114

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$0.130

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$0.114

Microchip USA

USA . 446 parts In-Stock

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$4.768

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446

$4.768

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AZTECH Wire

Italy . 1,074 parts In-Stock

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$8.620

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$8.620

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

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$28.371

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$25.534

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$28.371

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$25.534

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MKK Technologies

India . 111 parts In-Stock

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$53.350

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$53.350

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DigiPath Technology Company

USA . 111 parts In-Stock

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$53.350

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Component Stockers USA

USA . 249 parts In-Stock

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$99.990

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Perfect Parts

USA . 15,288 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,525 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,239 parts In-Stock

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Corphita

USA . 553 parts In-Stock

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Parana Technologies

USA . 46 parts In-Stock

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$33.922

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$33.922

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Overview

Elevate your designs with the 74LX1G86CTR from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance logic gate is engineered for exceptional speed and reliability, delivering lightning-fast propagation delays that enhance efficiency in a compact footprint. Ideal for a variety of applications—from consumer electronics to automotive systems—this versatile component offers unmatched quality and durability, ensuring your projects perform at their best while reducing time-to-market. Choose STMicroelectronics for innovation you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials can help reduce overall product weight while providing good protection.

Propagation Delay At Nominal Supply: 5 ns

Fast propagation delay allows for quick signal processing, making this gate suitable for high-speed applications.

Surface Mount: YES

Surface mount capability enables compact designs and easier integration into modern circuit boards.

No. of Inputs: 2

With two inputs, this logic gate can handle simple logic operations, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on circuit boards, allowing for efficient layout and connections.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage enhances energy efficiency, reducing overall power consumption in battery-powered devices.

Load Capacitance (CL): 50 pF

Moderate load capacitance allows for stable operation in various circuit conditions while minimizing signal distortion.

Power Supplies (V): 3.3

Compatibility with common power supply voltages ensures ease of integration into existing electronic designs.

No. of Terminals: 5

Five terminals provide flexible connectivity options, facilitating a range of circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design enhance space efficiency in compact electronic applications.

Maximum I (ol): 24 Amp

High output current capability supports demanding applications, ensuring reliable performance under load.

Propagation Delay (tpd): 9.9 ns

A propagation delay of 9.9 ns ensures responsiveness in fast digital circuits, making it suitable for advanced logic functions.

Maximum Operating Temperature: 125 °C

Supports high-temperature environments, making this product viable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Ability to operate in extreme low temperatures ensures reliability in harsh environmental conditions.

Terminal Finish: Matte Tin (Sn)

Durable finish improves solderability and enhances product reliability over its lifespan.

Terminal Position: DUAL

Dual terminal positioning allows for efficient layout and better signal integrity in circuit designs.

Maximum Seated Height: 1.1 mm

Low seated height enables integration into thin devices, supporting modern slim product designs.

Width: 1.25 mm

Compact width facilitates placement in high-density PCB applications, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage allows for compatibility with a wide range of power sources, increasing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak temperature permits compatibility with various soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

High peak temperature tolerance supports robust PCB assembly processes and ensures component reliability.

Length: 2 mm

Short length aids in achieving compact designs, allowing more components to fit in limited spaces.

Temperature Grade: MILITARY

Military grade temperature tolerance ensures product reliability in critical applications and extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better placement on PCB, enhancing assembly efficiency.

Packing Method: TR

Tape and reel packaging enables efficient automated assembly processes, improving manufacturing throughput.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for denser placement on PCBs, making it suitable for modern, compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

The range of acceptable supply voltages allows for adaptability in various application requirements.

Technical Specifications

Logic Gates 74LX1G86CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

9.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LX1G86CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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