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VN2222LL

Onsemi

VN2222LL by Onsemi

VN2222LL by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage, 0.15A max drain current, and 7.5 ohm max on resistance. Ideal for switching applications due to its single configuration with built-in diode and enhancement mode operation. Package style is cylindrical with through-hole terminals, suitable for operating temperatures up to 150 °C.

Median Price

$0.250

Lifecycle Status

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Overview

Looking for a reliable and high-quality Small Signal Field Effect Transistor (FET)? Look no further than the Onsemi VN2222LL. With its N-CHANNEL configuration, built-in diode, and enhanced mode operation, this transistor is perfect for switching applications. Onsemi's reputation for excellence in semiconductor technology ensures that you are getting a top-of-the-line product. Trust the VN2222LL to deliver superior performance and reliability, making it the ideal choice for your electronic projects. Add value to your designs with the VN2222LL from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor components, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient current conduction in the specified direction, suitable for various electronic applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient design with a built-in diode for circuit protection and versatility in usage.

Transistor Application: SWITCHING

Ideal for switching applications due to its fast response time and low power consumption.

Minimum DS Breakdown Voltage: 60 V

Can handle high voltage levels without breakdown, providing reliability in voltage regulation.

Package Shape: ROUND

Compact and space-saving design for easy integration into circuit boards.

Terminal Form: THROUGH-HOLE

Simplified installation and secure connection to the circuit board.

Operating Mode: ENHANCEMENT MODE

Efficient enhancement mode operation for enhanced performance in amplification and signal processing.

Maximum Drain Current (Abs) (ID): 0.099 A

Sufficient current handling capacity for various small signal applications.

No. of Terminals: 3

Simple and standard design with three terminals for easy connection in circuits.

Maximum Power Dissipation (Abs): 0.4 W

Capable of dissipating heat effectively to prevent overheating and ensure stable operation.

Package Style (Meter): CYLINDRICAL

Aesthetically pleasing cylindrical package style for a streamlined appearance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable and high-performance semiconductor technology for efficient signal processing.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, suitable for diverse environmental conditions.

Transistor Element Material: SILICON

Silicon material offers excellent conductivity and reliability for the transistor's functioning.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and connectivity for efficient circuit connections.

Maximum Drain Current (ID): 0.15 A

Higher drain current capacity for increased signal processing capabilities.

Maximum Drain-Source On Resistance: 7.5 ohm

Low on-resistance for minimal power loss and efficient signal transmission.

Terminal Position: BOTTOM

Bottom terminal position for easy mounting and connection in circuit boards.

Peak Reflow Temperature °C: 235

Can withstand high peak reflow temperatures during soldering processes, ensuring structural integrity.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance for minimal signal distortion and improved performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222LL attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.099 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2222LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-642-8929, 5961016428929

NIIN

016428929

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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