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VN2222LLRLRA

Onsemi

VN2222LLRLRA by Onsemi

VN2222LLRLRA by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage. Ideal for switching applications, it has a max drain current of 0.15A and built-in diode. Operating in enhancement mode, it offers low on-resistance of 7.5 ohm and can handle up to 0.4W power dissipation efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,221 parts In-Stock

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Digiode

USA . 1,490 parts In-Stock

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Sea View Technologies

USA . 118 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,984 parts In-Stock

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SupplyDigital Components

Austria . 6,533 parts In-Stock

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Kulean Microsystems

USA . 5,245 parts In-Stock

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TANS Electronics

Latvia . 4,716 parts In-Stock

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Problanco Electronics

Mexico . 1,825 parts In-Stock

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Corphita

USA . 1,622 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Overview

Enhance your electronic projects with the VN2222LLRLRA from Onsemi, a reliable leader in semiconductor manufacturing. This N-channel field-effect transistor with a built-in diode is perfect for switching applications, offering a high breakdown voltage of 60V and low on-resistance. With a maximum power dissipation of 0.4W and operating temperature of 150 °C, this transistor delivers superior performance and efficiency. Trust Onsemi's expertise and choose the VN2222LLRLRA for your next project to experience unmatched quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used for switching applications due to their faster switching speed and lower conduction losses.

Configuration: SINGLE WITH BUILT-IN DIODE

The presence of a built-in diode simplifies circuit design and can provide protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such scenarios.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages without breakdown, enhancing its reliability.

Maximum Drain Current (Abs) (ID): 0.099 A

Capable of handling a maximum drain current of 0.099A, making it suitable for low-power applications.

Maximum Power Dissipation (Abs): 0.4 W

With a maximum power dissipation of 0.4W, this FET can handle moderate power levels effectively.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, ensuring stability and reliability in various environments.

Maximum Drain Current (ID): 0.15 A

Capable of handling a maximum drain current of 0.15A, suitable for applications requiring higher current levels.

Maximum Drain-Source On Resistance: 7.5 ohm

With a low on-resistance of 7.5 ohms, this FET minimizes power loss and heat dissipation, improving efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology, known for high efficiency, fast switching speeds, and low input capacitance.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance of 5pF reduces the risk of oscillations and improves stability in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222LLRLRA attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.099 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2222LLRLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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