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VN2222RLRM

Onsemi

VN2222RLRM by Onsemi

VN2222RLRM by Onsemi is a N-CHANNEL FET with 60V DS breakdown voltage and 0.15A max drain current. Ideal for applications requiring low power dissipation, it features a built-in diode and operates in enhancement mode. With a max operating temperature of 150 °C, it is suitable for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,173 parts In-Stock

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Digiode

USA . 961 parts In-Stock

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Problanco Electronics

Mexico . 6,196 parts In-Stock

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TANS Electronics

Latvia . 4,417 parts In-Stock

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Kulean Microsystems

USA . 3,021 parts In-Stock

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SupplyDigital Components

Austria . 1,504 parts In-Stock

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UHIMA Technologies

Türkiye . 772 parts In-Stock

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Corphita

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Corohmni

South Africa . 365 parts In-Stock

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Overview

Enhance your electronic projects with the VN2222RLRM by Onsemi! This high-quality Small Signal Field Effect Transistor offers superior performance and reliability, ideal for a wide range of applications. With its N-CHANNEL configuration, built-in diode, and 60V minimum DS breakdown voltage, this transistor provides exceptional value and benefits to customers. Trust in Onsemi's reputation for excellence and innovation, and elevate your designs with the VN2222RLRM today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and is resistant to external elements, ensuring the longevity of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and better performance characteristics compared to P-channel FETs, making this transistor a good choice for applications requiring efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and allows for more compact layouts, making this transistor ideal for space-constrained applications.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this transistor can handle higher voltages, providing reliability in various circuit configurations.

Maximum Drain Current (ID): 0.15 A

The high maximum drain current of 0.15A allows for carrying higher current loads, making it suitable for applications requiring power amplification or switching capabilities.

Maximum Power Dissipation (Abs): 0.4 W

The maximum power dissipation of 0.4W ensures that the transistor can handle heat dissipation effectively, preventing overheating in operation.

Maximum Drain-Source On Resistance: 7.5 ohm

With a low ON resistance of 7.5 ohms, this transistor minimizes power loss and heat generation, improving efficiency in circuit applications.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5pF minimizes signal distortion and ensures stability in high-frequency applications, making this transistor suitable for use in RF circuits.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222RLRM attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.15 A

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

VN2222RLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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