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VN2222LLRL1

Onsemi

VN2222LLRL1 by Onsemi

VN2222LLRL1 by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.15A ID. It features SINGLE configuration with BUILT-IN DIODE, suitable for applications requiring ENHANCEMENT MODE operation. Ideal for designs needing low ON resistance (7.5 ohm) in a CYLINDRICAL package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,512 parts In-Stock

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Vyrian

USA . 245 parts In-Stock

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Kulean Microsystems

USA . 7,279 parts In-Stock

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7,279

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TANS Electronics

Latvia . 2,716 parts In-Stock

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SupplyDigital Components

Austria . 1,687 parts In-Stock

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Corphita

USA . 1,645 parts In-Stock

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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Problanco Electronics

Mexico . 116 parts In-Stock

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Overview

Enhance your electronic projects with the VN2222LLRL1 by Onsemi. Manufactured by a reputable company known for its quality products, this small signal Field Effect Transistor offers reliability and performance that customers can trust. With applications in amplifiers, switches, and voltage converters, this N-channel transistor provides valuable benefits such as efficient power management and enhanced circuit control. Discover the advantages of the VN2222LLRL1 for your next project and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and faster switching speeds compared to P-channel FETs, making them a good choice for various applications.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without getting damaged, making it suitable for high voltage applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that this FET can perform reliably in a wide range of temperature conditions.

Maximum Drain Current (ID): 0.15 A

This FET can handle a maximum drain current of 0.15A, making it suitable for low to medium power applications.

Maximum Drain-Source On Resistance: 7.5 ohm

The low on-resistance of 7.5 ohm helps in minimizing power loss and improving efficiency in various circuit designs.

Maximum Feedback Capacitance (Crss): 5 pF

The low feedback capacitance of 5pF helps in reducing signal distortion and improving high-frequency performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222LLRL1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.15 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Trade Compliance

VN2222LLRL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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