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VN2222LL-GP002

Microchip Technology

VN2222LL-GP002 by Microchip Technology

VN2222LL-GP002 by Microchip is a N-CHANNEL FET with 60V DS breakdown voltage, ideal for SWITCHING applications. It operates in ENHANCEMENT MODE with 1W power dissipation and 0.23A max drain current. With a package style of CYLINDRICAL, it has an operating temperature range of -55 to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,268 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 16,828 parts In-Stock

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$0.350

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Corohmni

South Africa . 364 parts In-Stock

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$1.874

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Ampacity Inc.

Singapore . 1,225 parts In-Stock

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$12.050

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AZTECH Wire

Italy . 710 parts In-Stock

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$19.371

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710

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West Coast Incorporated

USA . 4,403 parts In-Stock

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Argo Parts USA

USA . 1,799 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 42 parts In-Stock

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Overview

Elevate your electronic projects with the VN2222LL-GP002 by Microchip Technology. Known for their high-quality components, Microchip Technology brings you a reliable Small Signal Field Effect Transistor that is perfect for switching applications. With a maximum power dissipation of 1W and a minimum operating temperature of -55°C, this N-CHANNEL transistor offers exceptional performance. Whether you're a hobbyist or professional, the VN2222LL-GP002 provides value, efficiency, and reliability that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, resulting in faster switching speeds and lower on-state resistance, making this transistor efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage and inductive kickback, enhancing the reliability of the transistor in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for fast turn-on and turn-off times, making it ideal for controlling power in circuits.

Minimum DS Breakdown Voltage: 60 V

The minimum breakdown voltage of 60V ensures that the transistor can handle higher voltages without breakdown, providing reliability in high voltage applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to insert and solder the transistor onto a printed circuit board, ensuring secure connections and stability in the circuit.

Maximum Power Dissipation (Abs): 1 W

With a maximum power dissipation of 1W, this transistor can handle relatively high power levels without overheating, ensuring reliable performance in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance, low input capacitance, and low noise levels, making this transistor suitable for high-frequency applications where signal integrity is crucial.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can operate in high-temperature environments without performance degradation, increasing its versatility in various applications.

Maximum Drain Current (ID): 0.23 A

The maximum drain current of 0.23A allows this transistor to handle moderate current loads, making it suitable for low to medium power switching applications.

Maximum Drain-Source On Resistance: 7.5 ohm

The low drain-source on resistance of 7.5 ohms results in reduced power loss and higher efficiency in the on-state, making this transistor an excellent choice for power switching applications.

Maximum Feedback Capacitance (Crss): 8 pF

The low feedback capacitance of 8pF helps minimize signal distortion and improve high-frequency performance, making this transistor ideal for fast switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) VN2222LL-GP002 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Microchip Technology

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.23 A

Maximum Drain-Source On Resistance:

7.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8 pF

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

1 W

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

VN2222LL-GP002 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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